Real time resistance monitoring during sintering of silver paste

Abstract

Real time resistance monitoring technology is used to study the silver sintering process.Signals of joint resistance show events such as resistance increase to >10 GΩ, abrupt resistance drop from >10 GΩ to <1 kΩ, and gradual resistance drop to <1 mΩ. Based on cross-sectioning of samples at various stages of sintering and differential scanning calorimetry (DSC), we propose a correlation between resistance signal and solvent evaporation, capping agent degradation, and silver sintering. We identified distinct clusters of sintered silver of samples removed from the oven when the resistance drops to ~2.94 Ω.

A Novel Conductive Core–Shell Particle Based on Liquid Metal for Fabricating Real‐Time Self‐Repairing Flexible Circuits

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High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications

“…Nano-Ag paste has been studied as a possible alternative to Pb-free solder [10,11]. High surface energy of nanoparticles and consequent strong capillary force make it possible to achieve strong bonding [12][13][14][15]. After sintering, the melting point of sintered Ag returns to the melting point of bulk Ag so that the sintered chip attachment could operate at high temperature.…”

MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications

“…Low temperature sintering of metallic nanoparticle paste, such as nanoCu paste, has a great potential as interconnect solution in heterogeneous integration [1]. Experimental time-dependent insight of the sintering process is essential for both process optimization and material development [2,3]. This time-dependent study is however very limitedly reported, even for Ag nanoparticle paste, which is already developed and applied in interconnect solutions for high reliability and performance driven applications.…”

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