2020
DOI: 10.1039/c9tc05157k
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Highly stable performance of flexible Hf0.6Zr0.4O2 ferroelectric thin films under multi-service conditions

Abstract: Flexible HZO ferroelectric films with superior ferroelectricity, retention and fatigue endurance under multiple harsh conditions.

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Cited by 34 publications
(19 citation statements)
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“…While, as mentioned earlier, stable FE performance in (pseudo)​binary oxide thin films has been shown up to 150 °C in flexible Hf 0.6 Zr 0.4 O 2 thin films, and the ES performance of TiN/​Hf 0.33 Zr 0.66 O 2 /​Al 2 O 3 /​Hf 0.33 Zr 0.66 O 2 /​TiN capacitors is thermally stable up to 200 °C, it is imperative to also achieve strong ES performance in the range 150–250 °C. In this way, it will be possible to meet the requirements of the automotive (150–200 °C), power transmission (150–250 °C), aerospace (180–250 °C), and oil and gas industries (175–250 °C) .…”
Section: Challenges Potential Solutions and Future Opportunities For ...mentioning
confidence: 82%
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“…While, as mentioned earlier, stable FE performance in (pseudo)​binary oxide thin films has been shown up to 150 °C in flexible Hf 0.6 Zr 0.4 O 2 thin films, and the ES performance of TiN/​Hf 0.33 Zr 0.66 O 2 /​Al 2 O 3 /​Hf 0.33 Zr 0.66 O 2 /​TiN capacitors is thermally stable up to 200 °C, it is imperative to also achieve strong ES performance in the range 150–250 °C. In this way, it will be possible to meet the requirements of the automotive (150–200 °C), power transmission (150–250 °C), aerospace (180–250 °C), and oil and gas industries (175–250 °C) .…”
Section: Challenges Potential Solutions and Future Opportunities For ...mentioning
confidence: 82%
“…The orthorhombic phase is stabilized by a series of effects, including doping, strain, capping layer, oxygen vacancies, thermal expansion mismatch, surface energy, etc. ,, However, the aforementioned parameters are often coupled (e.g., strain and oxygen vacancies), and so future work will require careful decoupling of these parameters. Recently, a polar rhombohedral phase was also reported in ZrO 2 and Hf 0.5 Zr 0.5 O 2 thin films. There is promise also for HfO 2 and ZrO 2 materials in non-volatile memory devices, multiferroics, FE tunnel junctions, and field effect transistors. However, there is limited work on ES capacitors. Thus, we focus the rest of this review on the current status and prospects of using HfO 2 , ZrO 2 , and HZO in ES capacitors.…”
Section: Hfo2 and Zro2-based Materialsmentioning
confidence: 99%
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“…[41] Previous studies showed that HZO thin films directly grown on flexible mica substrates had robust ferroelectricity and promising application potential in flexible electronics. [42][43][44][45] The distinct advantage of our freestanding HZO membranes is that they can be easily transferred to almost any substrate to fabricate electronic devices, including substrates that cannot be annealed at high temperatures. Here we transferred the HZO capacitors onto mica as an example to demonstrate the robust ferroelectricity of our freestanding HZO membranes in flexible electronic devices.…”
Section: Resultsmentioning
confidence: 99%
“…[123] Flexible HZO films can acquire FE properties up to 420 K and are suitable for flexible cooling devices. [124] Flexible electronic devices can now be employed in devices associated with the development of the internet of things. [125] If films can be formed at temperatures as low as 400 °C, they may be able to be grown on flexible substrates.…”
Section: Zro 2 -And Hfo 2 -Based Materialsmentioning
confidence: 99%