2019
DOI: 10.4071/2380-4505-2019.1.000415
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Highly Miniaturized Integrated Sensor Nodes for Industry 4.0

Abstract: Paper Abstract The PCB 4.0 research project offers the opportunity to take the flexibility, energy efficiency, and resource efficiency of production processes to a whole new level through intelligent control and networking. The development of electronics and sensors, which is among the strengths of small and medium-sized enterprises (SMEs) in Germany in particular, plays a key role here. The integration of sensors into workpieces and systems must be as compact as possible for flexible and efficient data acqui… Show more

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Cited by 4 publications
(4 citation statements)
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“…Advances in wearable electronics (miniaturization of the necessary electronics to enable wearable computing) could allow for easier measurement within an experiment, mainly due to ease of use [20]. Today, these electronics are capable of recording user data in real time.…”
Section: Gsrmentioning
confidence: 99%
“…Advances in wearable electronics (miniaturization of the necessary electronics to enable wearable computing) could allow for easier measurement within an experiment, mainly due to ease of use [20]. Today, these electronics are capable of recording user data in real time.…”
Section: Gsrmentioning
confidence: 99%
“…To avoid energy loss due to leaking, incorporating energy harvesting techniques, such as kinetic and thermal energy scavenging, is essential for optimizing sensor node battery life. Furthermore, energy conservation strategies such as power‐saving protocols must be used to manage energy consumption 12 …”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, energy conservation strategies such as power-saving protocols must be used to manage energy consumption. 12…”
mentioning
confidence: 99%
“…The work of Lynch and Loh [10] provides a good overview of different approaches for sensor nodes and sensor networks and different power supply possibilities for both approaches, attached to the monitored component and material integrated. In the field of embedding miniaturized sensor nodes, Voges et al [11] presented a monolithic epoxy covered system for smart manufacturing in Industry 4.0.…”
Section: Introductionmentioning
confidence: 99%