Highly impermeable and flexible silica encapsulation films synthesized by sol—gel process

Kim, Si-Hoon; Hwang, Gyeong‐Seok; Koo, Donghwan; Seo, Dong-Ho; Kwon, Ye-Pil; Lee, Hansuek; Park, Hyesung; Jeon, Eun‐chae; Kim, Ju‐Young

doi:10.1007/s12274-022-4356-9

Cited by 3 publications

(1 citation statement)

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“…Stretchable electronic devices have been receiving increasing attention lately due to their potential applications in various fields. − In the case of bending deformation, the mechanically weakest material can be protected from severe deformation using a structural design with the neutral plane concept. − However, all constituent materials in a stretchable device should be uniformly stretched under iso-strain conditions, where the structural design does not function, and the mechanically weakest constituent material determines the stretchability of the entire device. Among the various constituent materials, metals are considered as one of the mechanically weakest materials.…”

Section: Introductionmentioning

confidence: 99%

Highly Elastic and Conductive Metallic Interconnect with Crystalline–Amorphous Nanolaminate

Hwang

Bae

Kim

et al. 2023

ACS Appl. Mater. Interfaces

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Nanolaminate with alternating layers of nanocrystalline Cu and amorphous CuZrTi is suggested as highly stretchable and conductive interconnect material in stretchable devices. 50 nm nanocrystalline Cu and 20 nm amorphous CuZrTi are the optimum thicknesses of the constituent layers, which result in an elastic deformation limit of 3.33% similar to that of the monolithic amorphous CuZrTi film and an electrical conductivity of 11.83 S/μm corresponding to 70% of that of the monolithic nanocrystalline Cu film. The enhanced elastic deformability and conductivity of the nanolaminates enable the maintenance of the interconnect performance for cyclic stretching with a tensile strain of 114% in the form of a free-standing serpentine structure and a tensile strain of 30% in the form of an ordinary circular coil on an elastomer substrate.

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