Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC

Abstract

Mn-Co Spinel is considered as one of the most promising materials for the interconnect protection of solid oxide fuel cells; however, its conductivity is too low to maintain a high cell performance as compared with cathode materials. Element doping is an effective method to improve the spinel conductivity. In this work, we proposed doping Mn-Co spinel powder with Cu via a solid phase reaction. CuδMn1.5−xCo1.5−yO4 with δ = 0.1, 0.2, 0.3, and x + y = δ was obtained. X-ray diffraction (XRD) and thermogravimetry-differential scanning calorimetry (TG-DSC) were used to evaluate the Cu-doping effect. After sintering at 1000 °C for 12 h, the yield exhibited the best crystallinity, density, and element distribution, with a phase composition of MnCo2O4/CuxMn3−xO4 (x = 1, 1.2, 1.4 or 1.5). X-ray photoelectron spectroscopy (XPS) was used to semi-quantitatively characterize the content changes in element valence states. The areal fraction of Mn2+ and Co3+ was found to decrease when the sintering duration increased, which was attributed to the decomposition of the MnCo2O4 phase. Finally, coatings were prepared by atmospheric plasma spraying with doped spinel powders and the raw powder Mn1.5Co1.5O4. It was found that Cu doping can effectively increase the conductivity of Mn-Co spinel coatings from 23 S/cm to 51 S/cm. Although the dopant Cu was found to be enriched on the surface of the coatings after the conductivity measurement, which restrained the doping effect, Cu doping remains a convenient method to significantly promote the conductivity of spinel coatings for SOFC applications.