Highly anisotropic graphene/boron nitride hybrid aerogels with long-range ordered architecture and moderate density for highly thermally conductive composites

An, Fengping; Li, Xiaofeng; Peng, Min; Li, Hongfei; Dai, Zhen; Yu, Zhong‐Zhen

doi:10.1016/j.carbon.2017.10.011

Cited by 202 publications

(110 citation statements)

References 48 publications

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“…The pore structures were further investigated by mercury intrusion tests and the results were listed in Table S2 (Supporting Information). All the samples show high porosity (81.37–93.52%) and low bulk density . With the increase of heat‐treatment temperature, the porosity only shows slight decrease, which is in accordance with the scanning electron microscope (SEM) images in Figure a–c.…”

supporting

confidence: 85%

3D Thermally Cross‐Linked Graphene Aerogel–Enhanced Silicone Rubber Elastomer as Thermal Interface Material

Zhang

Kong

Tao

et al. 2019

Adv Materials Inter

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supporting

confidence: 85%

3D Thermally Cross‐Linked Graphene Aerogel–Enhanced Silicone Rubber Elastomer as Thermal Interface Material

Zhang

Kong

Tao

et al. 2019

Adv Materials Inter

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“…However, 3D network of highly oriented graphene would be used to fabricate high-quality thermal conductive network. GO has been synthesized by modified Hummer's method [6][7][8]. Park et al [9] first prepared few-layer graphene (FLG) through interlayer catalytic exfoliation and then incorporated to the epoxy matrix to prepare TIMs demonstrating thermal conductivity of 3.87 ± 0.28 W/mK at 10 vol% of filler loading.…”

Section: Introductionmentioning

confidence: 99%

Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application

Nayak

Mohanty

2019

SN Appl. Sci.

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In recent years, significant interest has been focused on fabricating epoxy-based hybrid composite with a high thermal conductivity at optimum filler loading. As epoxy usually has a low thermal conductivity, the high intrinsic thermal conducting fillers such as h-BN, GO and RGO are incorporated. In this research, we report the epoxy-based hybrid composites with an enhanced thermal conductivity through silane-modified h-BN (mh-BN) with RGO. The sample containing 44.5 wt% (40 wt% mh-BN and 4.5 wt% RGO) hybrid filler exhibited the highest thermal conductivity (1.416 W/mK) which was 7 times that of pristine epoxy (0.21 W/mK). The thermal conductivities of RGO with unmodified h-BN (0.789 W/mK), GO with mh-BN (0.769 W/mK) and GO with unmodified h-BN (0.713) at 44.5 wt% loading are also reported. Comparison property studies of these above-mentioned four hybrid composites are described by lap shear strength, flexural strength, impact strength and thermogravimetric analysis. The fabricated hybrid composites exhibit outstanding performance in lap shear strength, thermal stability, and slightly reduced impact and flexural strength, which makes it as relevant for electronics packaging application such semiconductors, integrated circuit packaging, optoelectronics and also can attest potentiality in structural energy storage application. The atomic force microscopy and scanning electron microscopy verified the surface roughness and morphology of two optimized compositions, i.e., mh-BN with RGO and h-BN with RGO with the epoxy matrix. Also, Maxwell, Hashin-Shtrikmann and series equations are used to verify the obtained experimental value.

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“…For polymers and biomolecules, hydrogen bonding and electrostatic interaction occur between functional groups such as –OH, and –NH 2 from additives, and oxygen‐containing groups on GO greatly facilitate the self‐assembly of the hydrogel. Moreover, GO was used as a gelation agent to help the self‐assembly of other 2D material nanosheets like MoS 2 , [ 35 ] C 3 N 4 , [ 36 ] and h ‐BN, [ 37 ] and corresponding 3D macrostructures could also be obtained through easy control of the gelation process.…”

Section: Fabrication Of 2d Material‐based Macrostructuresmentioning

confidence: 99%

Recent Progress in 3D Printing of 2D Material‐Based Macrostructures

Yang

Zhou

Yang

et al. 2020

Adv Materials Technologies

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2D materials have a range of unique properties and are promising building blocks for the fabrication of macroscopic materials for many applications ranging from flexible electronics to energy storage devices. The development of effective methods to fabricate 2D material‐based macroscopic materials with designed structures is the key to enabling high performance. Lately, 3D printing has emerged as a new technique to assemble such materials. Compared to conventional fabrication methods, 3D printing techniques have a high degree of customization of the structure with a broad range of domain sizes from nanometers to centimeters, and thereby give the resulting products additional structure‐related functionalities. Recent advances in the fabrication of 2D material‐based macrostructures using 3D printing techniques and their uses in different fields are reviewed. Challenges and opportunities for the future development of the topic are also discussed.

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Highly anisotropic graphene/boron nitride hybrid aerogels with long-range ordered architecture and moderate density for highly thermally conductive composites

Cited by 202 publications

References 48 publications

3D Thermally Cross‐Linked Graphene Aerogel–Enhanced Silicone Rubber Elastomer as Thermal Interface Material

3D Thermally Cross‐Linked Graphene Aerogel–Enhanced Silicone Rubber Elastomer as Thermal Interface Material

Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application

Recent Progress in 3D Printing of 2D Material‐Based Macrostructures

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