2014
DOI: 10.1109/tcpmt.2013.2284068
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High-Yield Fabrication Process for 3D-Stacked Ultrathin Chip Packages Using Photo-Definable Polyimide and Symmetry in Packages

Abstract: Abstract-Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology, which has a broad range of industrial and medical electronic applications. This goal is achieved in a two-step approach: at first thinned dies are embedded in a polyimide interposer with a fine-pitch metal fan-out resulting Ultra-Thin Chip Packages (UTCP), next these UTCPs are stacked by lamination.Step height at the chip edge of these UTCPs is the major … Show more

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Cited by 15 publications
(2 citation statements)
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References 11 publications
(18 reference statements)
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“…For the Alpha project, the picosatellite payload was developed by Dr. Van Hunter Adams [14,15], (previously at Cornell). The satellite is printed on a thin Kapton substrate [16,17] and only has a solar panel, processor, IMU, GPS, light sensor, and RF transceiver. The satellite is named ChipSat.…”
Section: Background On Subsystems Covered In This Manuscriptmentioning
confidence: 99%
“…For the Alpha project, the picosatellite payload was developed by Dr. Van Hunter Adams [14,15], (previously at Cornell). The satellite is printed on a thin Kapton substrate [16,17] and only has a solar panel, processor, IMU, GPS, light sensor, and RF transceiver. The satellite is named ChipSat.…”
Section: Background On Subsystems Covered In This Manuscriptmentioning
confidence: 99%
“…The three-dimensional integrated circuit (3D IC) is becoming an attractive technology to accommodate multiple heterogeneous dies such as logic, memory, analog, RF, and micro-electrical mechanical systems (MEMS). [1][2][3] Through silicon via (TSV) provides a structure of vertical connection to shorten the transmission wire to reduce the RC delay, and thus the performance of the IC can be improved by lowering power consumption with a shortened wiring network. 4) 3D IC with TSV is expected to have a broad impact in areas such as networking, graphics, mobile communications, and computing, especially for applications that require ultra-light, small, lowpower devices.…”
Section: Introductionmentioning
confidence: 99%