High-yield assembly of multichip modules through known-good IC's and effective test strategies

Application Specific Electronic Module Program (ASEM), Final Technical Report.

“…This standard 'triplate' structure was evaluated for this MCM, but resulted in a cross section of 42 layers. By screening X and Y wiring channels on the same layer and stacking three wiring layers together before adding a reference plane, and by reducing [6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22] I I the wiring pitch from 0.020" to 0.010", the cross section was reduced to 20 layers. The screening technology required to achieve this is similar to what is used on redistribution layers, except the redistribution lines are generally much shorter.…”

“…The importance of being able to assume high-quality die [10,12] has fostered the formation of an industry I group. The focus of this effort, referred to as Known Good Die (KGD), is to develop standards for die suppliers.…”

“…The second form is associated with the quality of components such as KGD and other hardware quality issues. Since the KGD issue has been discussed elsewhere [9][10][11][23][24][25], we will focus discussion on data problems related to device hardware descriptions rather than hardware quality specification issues.…”

“…Unknown die quality also introduces added complexity in module testing and the diagnostics process which leads to unanticipated higher costs for a completed module. KGD is one of the most discussed topics in MCM community today because of its key role in enabling a manufacturable MCM [10][11][12][23][24][25].…”

“…The gallery cover plate closest to the MCM under test consists of a plate with tubular orifices which, when the door is closed, directs the nitrogen flow directly onto the chips requiring cooling. The readily replaceable cover plate is simple in I 1 [3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20] I i design, and inexpensive to fabricate, thus reducing the cost and TAT associated with thermal management during uncapped testing of MCMs.…”