High transmission gain integrated antenna on extremely high resistivity Si for ULSI wireless interconnect

Characteristics of on-chip dipole antenna using diamond for intra-chip wireless interconnect

“…Therefore, radiation pattern analysis is omitted in the following sections. According to Friis transmission equation [10,11], the maximum power transmission in theory is…”

“…Figure 1 shows the concept of intra-chip and inter-chip wireless interconnection with on-chip dipole antennas [2]. The related characteristics of integrated antennas have been widely investigated [1][2][3][4][5][6][7][8][9][10][11][12][13]. For instance, Cao et al [3] demonstrated that wireless communication at 24 GHz between a base station and a receiver with on-chip antenna over a distance of 95 m was possible.…”

18.2 GHz Differential Low Noise Amplifier for On-chip Ultra Wide Band Transceiver

“…The speed limitations of conventional interconnect metal lines have led to the concept of onchip wireless interconnections using integrated antenna on Si [3][4][5]. For high data transmission rates and multiple access capabilities of the wireless interconnect system, wideband characteristics of an integrated transmitter and receiver are required.…”

“…Since on-chip integrated antenna will feed the LNA directly it should have high operating frequency in order to reduce the antenna size. If the size of the dipole antenna is limited to 2 mm in length, the operating frequency of the LNA should be 18 GHz [4]. Again the gain characteristics of the antenna [4} and its use in a UWB system [6] require that the LNA should have ultra wide bandwidth.…”

10× improvement of power transmission over free space using integrated antennas on silicon substrates

“…The region close to the dipole antenna maybe liken to a spherical resonator within which pulsating energy is trapped [6], so the performance of on-chip dipole antenna on a silicon substrate significantly suffers fkom the loss. Because of this, as the data indicated, the power transmission gain of antenna pairs can be improved by thinning silicon substrates, increasing the substrate resistivity, and decreasing the spacing between the antenna and chip edge.…”