High-throughput optical inter-board interconnects for next-generation on-board digital transparent processors

Venet, N.; Sotom, M.; Gachon, H.; Foucal, Vincent; Pez, M.; Heikkinen, Ville; Tuominen, T.; Pantoja, Sebastián

doi:10.1117/12.2304235

Cited by 4 publications

(5 citation statements)

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“…To keep up with the demand for increasing processor capacity, disruptive technologies have been introduced for each DTP generations. Since DTP5G, high-speed electrical interconnects have been replaced by optical interconnects [1,2,3,4]. On DTP5G, optical transceivers working at high speed data rate higher than 10 Gbps were introduced after a selection and qualification process [5,6,8].…”

Section: On Board Digital Transparent Processormentioning

confidence: 99%

Optical interconnect evaluation process for Thales Alenia Space latest generation of Digital Transparent Processor, DTP6G, and a projection into future needs

Cyrille

Venet

Van

et al. 2023

International Conference on Space Optics — ICSO 2022

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Flexibility and in-flight reconfigurability offered by digital processing have become key features in today's telecom satellite payloads. In recent years, Thales Alenia Space have developed several generations of on-board digital transparent processors (DTP) by introducing the most advanced and disruptive technologies. After several payloads based on 5th generation processors, Thales Alenia Space Space Inspire solution uses a 6th generation processors offering another step in flexibility through Digital Beam Forming. The mechanical architecture of such advanced digital processors is based on input/output routing channel modules and switch modules interconnected thanks to optical links. The end-to-end architecture of the optical links was optimized based on the return of experience of the 5th generation of DTP. Increasing processing capacity led to selection of links at datarates above 20 Gbps for the latest DTP generation. The optical interconnect solution is scalable to an overall throughput in excess of 65 Terabit/s with more than 1800's of optical links.In the frame of the development of DTP6G, Thales Alenia Space have led an evaluation process of optical transceivers, compatible with GEO to LEO environments and with a 15-year mission reliability .. Future processor developments are already under preparation with ever increasing processing power and datarates based on the next generations of transceiver which are starting to appear. The paper will present the evaluation process of the transceivers for Thales Alenia Space's latest processor generation, the update in the optical link architecture, as well as a first projection towards the targeted needs for the next generations of optical links.

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Section: On Board Digital Transparent Processormentioning

confidence: 99%

Optical interconnect evaluation process for Thales Alenia Space latest generation of Digital Transparent Processor, DTP6G, and a projection into future needs

Cyrille

Venet

Van

et al. 2023

International Conference on Space Optics — ICSO 2022

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show abstract

“…Tenerife, Canary Islands, Spain International Conference on Space Optics 7 -10 October 2014 the past, TAS developed early optical interconnect breadboards [4] featuring tens of optical links each operating at up to 2.5 Gbps to assess the technology available at that time. Under the ESTEC contract N° 22018/08/NL/NA Optical Inter-board Interconnects for High Throughput on-Board Processors (OI2), Thales Alenia Space has been cooperating with VTT, D-Lightsys, Patria and DAS Photonics, with the objective to design, develop and test a breadboard demonstrator of a very high-density highcapacity optical interconnect solution suitable for application in advanced digital transparent processors.…”

Section: Icso 2014mentioning

confidence: 99%

High-throughput optical inter-board interconnects for next-generation on-board digital transparent processors

Venet

Sotom

Gachon

et al. 2017

International Conference on Space Optics — ICSO 2014

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“…Veli Heikkinen (1) , Eveliina Juntunen (1) , Mikko Karppinen (1) , Kari Kautio (1) , Jyrki Ollila (1) , Aila Sitomaniemi (1) , Antti Tanskanen (1) , Rory Casey (2) , Shane Scott (2) , Hélène Gachon (3) , Michel Sotom (3) , Norbert Venet (3) , Jaakko Toivonen (4) , Taisto Tuominen (4) , and Nikos Karafolas (…”

Section: High-speed Adc and Dac Modules With Fibre Optic Interconnectunclassified

“…(1) VTT, Kaitoväylä 1A, FI-90570 Oulu, Finland, E-mail: veli.heikkinen@vtt.fi (2) Fibrepulse Ltd., Castlebar Technology Park, Moneen, Castlebar, Co. Mayo, Ireland (3) Thales Alenia Space, 26 avenue J.F. Champollion -BP 33787, 31037 Toulouse, France (4) Patria Aviation Oy, Naulakatu 3, FI-33100 Tampere, Finland (5) …”

Section: )mentioning

confidence: 99%

“…In summary, high-speed digital signal processing is expected to be widely spread in future telecom repeaters and antenna beam-forming networks. In this perspective, we have undertaken to assess the benefits and constraints of optical interconnections [2] as a communication technology for supporting the huge amounts of data expected in future digital processorbased payloads. In particular, ADC and DAC modules with fibre optic interfaces are of outmost interest.…”

Section: Modern Telecom Payloadsmentioning

confidence: 99%

See 1 more Smart Citation

High-speed ADC and DAC modules with fibre optic interconnections for telecom satellites

Heikkinen

Juntunen

Karppinen

et al. 2017

International Conference on Space Optics — ICSO 2008

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High-throughput optical inter-board interconnects for next-generation on-board digital transparent processors

Cited by 4 publications

References 1 publication

Optical interconnect evaluation process for Thales Alenia Space latest generation of Digital Transparent Processor, DTP6G, and a projection into future needs

Optical interconnect evaluation process for Thales Alenia Space latest generation of Digital Transparent Processor, DTP6G, and a projection into future needs

High-throughput optical inter-board interconnects for next-generation on-board digital transparent processors

High-speed ADC and DAC modules with fibre optic interconnections for telecom satellites

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