High-throughput electron beam direct writing of VIA layers by character projection using character sets based on one-dimensional VIA arrays with area-efficient stencil design

Ikeno, Rimon; Maruyama, Takashi; Iizuka, Tetsuya; Komatsu, Setsuko; Ikeda, Makoto; Asada, Kunihiro

doi:10.1109/aspdac.2013.6509605

Cited by 6 publications

(2 citation statements)

References 8 publications

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“…Du et al introduced an area-efficient stencil design for VIA patterns that allows three VIAs in each shot [10]. Also, we proposed a VIA CP strategy with character sets consisting of only one-dimensional VIA arrays along with an area-efficient stencil design scheme, and reported CP efficiency of 4~6 VIA/shot in average [11].…”

Section: Efforts For Cp Efficiency Improvementmentioning

confidence: 98%

A structured routing architecture and its design methodology suitable for high-throughput electron beam direct writing with character projection

Ikeno

Maruyama²,

Komatsu

et al. 2013

Proceedings of the 2013 ACM International Symposium on Physical Design

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beam source 1st aperture (beam shaping) 2nd aperture (character stencil) wafer (resist) exposed character el ectron beam characters ABSTRACTTo improve throughput of Electron Beam Direct Writing (EBDW) with Character Projection (CP) method, we propose a structured routing architecture (SRA) where VIA placement and wire-track interchange is restricted so as to reduce possible layout patterns in VIA and metal layers. CP exposure is accelerated by the increased figure numbers of VIAs and metal segments in each CP character due to the reduced character variations. We demonstrate a design flow that enables routing on the interconnect layer with the limited flexibility using a commercial routing tool and a few own programs. We also present a methodology to design character stencils with improved area efficiency by character superposition. Our experimental results proved the architecture's feasibility in achieving the target EBDW performance in 14nm technologies.

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Section: Efforts For Cp Efficiency Improvementmentioning

confidence: 98%

A structured routing architecture and its design methodology suitable for high-throughput electron beam direct writing with character projection

Ikeno

Maruyama²,

Komatsu

et al. 2013

Proceedings of the 2013 ACM International Symposium on Physical Design

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show abstract

“…Character and/or stencil design for interconnect layers and via layers are addressed in [8]- [11]. When an e-beam is projected onto the stencil, it covers a region which we call the projection region (see Fig.…”

Section: Introductionmentioning

confidence: 99%

E-Beam Lithography Character and Stencil Co-Optimization

Mak

Chu

2014

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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Abstract-Electron-beam maskless lithography is being actively explored by the semiconductor industry for chip production in the sub-22nm regime. Character projection allows in one ebeam shot the printing of complex pattern rather than merely a single rectangle or triangle as in variable-shaped beam projection. However, those circuit patterns that do not match any character on the stencil still have to be written by variable-shaped beam projection. We investigate a new problem of character and stencil co-optimization with blank space sharing between characters so as to minimize the total number of shots required for printing a circuit. We exploit the fact that the blank spaces on the sides of a character can be adjusted by moving the pattern to be printed within its projection region to facilitate blank space sharing so as to pack more characters into the stencil. Even though the co-optimization problem is shown to be NP-complete, we are able to design an elegant approximation algorithm, CASCO. Experiments confirm that the solutions by CASCO are nearly optimal. Compared to the published state of the art, CASCO reduces the shot count by 1.59× while it is also orders of magnitude faster.

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Design for Manufacturability with E-Beam Lithography

Pan

2016

Design for Manufacturability With Advanced Lithography

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High-throughput electron beam direct writing of VIA layers by character projection using character sets based on one-dimensional VIA arrays with area-efficient stencil design

Cited by 6 publications

References 8 publications

A structured routing architecture and its design methodology suitable for high-throughput electron beam direct writing with character projection

A structured routing architecture and its design methodology suitable for high-throughput electron beam direct writing with character projection

E-Beam Lithography Character and Stencil Co-Optimization

Design for Manufacturability with E-Beam Lithography

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