High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Wei, Hubo; Li, Xian; Ye, Xu; Guo, Chao; Peng, Juan; Liu, Jiaying; Yang, Junxiao; Chen, Jinxiang

doi:10.3390/polym15132843

Cited by 4 publications

(1 citation statement)

References 37 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These research endeavors provide valuable functional support for this study’s theoretical and methodological investigations. In contrast to epoxy resin, polymers containing BCB groups can be cured into resin without necessitating a catalyst and without generating any byproducts during the curing process. − This inherent advantage also streamlines the process of the simulation research. However, simulation research on BCB-based resins has not significantly improved despite this benefit.…”

Section: Introductionmentioning

confidence: 99%

Dielectric Properties of Benzocyclobutene-Based Resin: A Molecular Dynamics Study

Chen,

Yi,

Lan

et al. 2023

J. Phys. Chem. B

Self Cite

View full text Add to dashboard Cite

Benzocyclobutene (BCB)-based resins have garnered considerable attention because of their remarkable dielectric properties and thermal stability. However, in molecular dynamics (MD) simulations, progress in BCB-based resin research has yet to keep pace with experimental advancements, resulting in a shortage of theoretical underpinnings at the molecular level. This study focuses on a novel homopolymer, poly(2-(4-benzocyclobutenyl)-divinylbenzene(DVB-S-BCB)), and devises an interactive methodology suitable for BCBbased resins. We implemented a Python script for the joint relaxation method to construct a three-dimensional model of the cured polymer using MadeA and LAMMPS. We conducted MD simulations to investigate how the cross-linking degree and resin molecular weight influence the dielectric properties of the cured polymer. Furthermore, we analyzed the thermodynamic properties through simulation. The results illustrate that augmenting the cross-linking degree and resin molecular weight results in a higher cross-linking density and reduced free volume, thereby increasing the dielectric constant of the resin. The cross-link density does not increase indefinitely with molecular weight, and after a certain threshold is reached, it cannot have a significant effect on the dielectric constant. The degree of cross-linking exerts a more pronounced impact on the dielectric constant than the molecular weight of the resin. In addition, the simulation results denote the excellent thermodynamic properties of the cured polymer. This study also examines the dielectric and thermodynamic properties of the resin samples that were experimentally prepared. The obtained data successfully confirm the reliability of the simulation results. This study offers novel insights for future simulation research on benzocyclobutene-based resins. Additionally, it provides theoretical support for exploring experimental work on low-dielectric materials in the electronic field.

show abstract

Section: Introductionmentioning

confidence: 99%

Dielectric Properties of Benzocyclobutene-Based Resin: A Molecular Dynamics Study

Chen,

Yi,

Lan

et al. 2023

J. Phys. Chem. B

Self Cite

View full text Add to dashboard Cite

show abstract

Branched benzocyclobutene polysiloxane with excellent photo-patterning and low dielectric properties

Peng,

Guo,

et al. 2024

RSC Appl. Polym.

Self Cite

View full text Add to dashboard Cite

show abstract

Site-specific molecular design of low-dielectric benzocyclobutene (BCB)-sub-nanometer inorganic nanocomposites

Fu,

Xie,

Fan

et al. 2024

Preprint

View full text Add to dashboard Cite

A facile synthetic strategy for generating polymer-inorganic nanocomposites with highly dispersed nanodomains, such as silsesquioxane, covalently bonded within a benzocyclobutene (BCB)-functionalized polycarbosiloxane matrix is reported. This approach leverages click coupling and thermally induced cycloaddition reactions to embed oligomeric silsesquioxane, achieving a unique molecular structure with promising low-dielectric applications. The synthesis involves a platinum-catalyzed hydrosilylation to prepare the silsesquioxane component, followed by hydrolytic polycondensation and thiol-ene click reactions that integrate polyhedral oligomeric silsesquioxane ladder/cage-like or network structures into the polymer matrix. A subsequent Diels-Alder reaction with BCB ensures a fully cured material. The distinct molecular structure bestows the materials with an ultra-low dielectric constant (Dk) of 1.78 and a dissipation factor (Df) of 2.73×10-3 at 1.15 kHz, positioning these values among the top reported for low-dielectric (low-k) materials. This discovery introduces a pioneering design paradigm for polymer-inorganic nanocomposites with well-dispersed sub-nanometer inorganic structure, paving the way for the future investigation of BCB−inorganic nanocomposites with ultra-low Dk.

show abstract

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Cited by 4 publications

References 37 publications

Dielectric Properties of Benzocyclobutene-Based Resin: A Molecular Dynamics Study

Dielectric Properties of Benzocyclobutene-Based Resin: A Molecular Dynamics Study

Branched benzocyclobutene polysiloxane with excellent photo-patterning and low dielectric properties

Site-specific molecular design of low-dielectric benzocyclobutene (BCB)-sub-nanometer inorganic nanocomposites

Contact Info

Product

Resources

About