High Thermal Conductivity Materials

Shindé, Subhash L.; Goela, Jitendra S.

doi:10.1007/b106785

Cited by 127 publications

(7 citation statements)

References 39 publications

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“…In the contrary case, materials with low conductivity are used as thermal insulators. The thermal conductivity of materials depends on the temperature, and its inverse is the thermal resistivity [2].…”

Section: Introductionmentioning

confidence: 99%

“…In general, techniques for the steady states are useful when the temperature is unchanged in time [2]. At atomic level, there are no simple expressions to phrase the thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

“…Although these are analytical, the calculation is carried out by molecular dynamics (MD) for dense fluid and solids [2]. (ii) Relaxation time approximation.…”

Section: Introductionmentioning

confidence: 99%

“…(ii) Relaxation time approximation. The heat transfer is because of the anharmonicity of the potential in the crystal, which is known as phonon conductivity, studied by the Monte Carlo method [2]. The MD simulation is for now a well-established method to calculate several transport and thermal properties in fluids [3].…”

Section: Introductionmentioning

confidence: 99%

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Thermal conductivity of argon: Modeling and comparison with experimental data

Revollo

Curilef

2018

J. Phys.: Conf. Ser.

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Abstract. The thermal conductivity of argon in solid state phase is modeled by studying the physics property of atom vibrations given by different potentials in crystalline networks at temperature less than 80 [K], in the canonical ensemble where volume, mass and temperature are held constant. Mfolecular dynamics simulations are carried out taking into account the Verlet algorithm and the Green-Kubo formalism. We consider some interatomic interactions as Lennard-Jones, Mie and Kihara potential to obtain results that we compare to experimental data. We show that the present modeling based on the Kihara potential is the best, showing a precision (8.8%), which is not found in recent literature.

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Section: Introductionmentioning

confidence: 99%

“…In general, techniques for the steady states are useful when the temperature is unchanged in time [2]. At atomic level, there are no simple expressions to phrase the thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

“…Although these are analytical, the calculation is carried out by molecular dynamics (MD) for dense fluid and solids [2]. (ii) Relaxation time approximation.…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Thermal conductivity of argon: Modeling and comparison with experimental data

Revollo

Curilef

2018

J. Phys.: Conf. Ser.

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“…На рис. 2 представлена вольт-амперная характеристика (ВАХ), полученная на пленке С 60 толщиной L = 250 nm при площади пятна контакта S ≈ 0.03 mm 2 [6,7], но впервые установлен в настоящей работе для тонких поликристаллических пленок С 60 .…”

unclassified

Эффект Электроформовки В Поликристаллических Пленках Фуллерена С-=sub=-60-=/Sub=-

Захарова¹,

Долженко²,

Бородзюля³

et al. 2019

Письма В Журнал Технической Физики

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Long-term exposure of a polycrystalline fullerene C_60 film in a constant electric field of 1–4 MV/cm produces an electroforming effect manifested by increase in conductivity of the film within several orders of magnitude. After this electroforming, the current–voltage ( I – U ) characteristic shows a high degree of current stability and reproducibility of results. In fields of 10^5–10^6 V/cm, the I – U characteristics of electroformed films are determined by the space-charge limited current. The concentration ( N _ t ≈ 4 × 10^21 m^–3) of carrier traps and their energy ( E _ t ≈ 0.176 eV) have been estimated.

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Effect of Interface Evolution on Thermal Conductivity of Vacuum Hot Pressed SiC/Al Composites

Chen

Tan

et al. 2015

Adv Eng Mater

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The SiC/Al composites have been fabricated by a vacuum hot pressing (VHP) process in order to study the effect of interface evolution on the global thermal conductivity (TC). By optimizing the VHP parameters of sintering temperature and time, the three different kinds of SiC/Al interface configurations, that is, non-bonded, diffusion-bonded, and reaction-bonded interfaces, are formed and identified by measurement of relative density, X-ray diffraction, scanning and (high-resolution) transmission electron microscopy. The VHPed composite sintered at 655°C for 60 min is fully dense and presents a tightly-adhered and clean SiC/Al interface at the nanoscale, the ideal diffusion-bonded interface being the most favorable for minimizing interfacial thermal resistance, which in turn results in the highest TC of around 270 W/mK. 1076 wileyonlinelibrary.com

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High Thermal Conductivity Materials

Cited by 127 publications

References 39 publications

Thermal conductivity of argon: Modeling and comparison with experimental data

Thermal conductivity of argon: Modeling and comparison with experimental data

Эффект Электроформовки В Поликристаллических Пленках Фуллерена С-=sub=-60-=/Sub=-

Effect of Interface Evolution on Thermal Conductivity of Vacuum Hot Pressed SiC/Al Composites

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