Effect of Interface Evolution on Thermal Conductivity of Vacuum Hot Pressed SiC/Al Composites

Chen, Zhizhong; Tan, Zhanqiu; Ji, Gang; Fan, Genlian; Schryvers, D.; Ouyang, Qiubao; Li, Zhi Qiang

doi:10.1002/adem.201400412

Cited by 21 publications

(5 citation statements)

References 25 publications

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“…It is well-known that interfacial bonding states, namely non-bonded, diffusion-bonded and reactionbonded interfaces, can have a significant impact on global TC of MMCs whatever the employed VHP or SPS fabrication techniques. It has previously been demonstrated in VHPed SiC/Al composites that the formation of the nanoscale diffusion-bonded interface is the most favorable for TC enhancement [21]. This experimental result is also in good agreement with our predictive model since it is expected that the diffusion-bonded interface can provide not only necessary bonding strength but also low ITR [22].…”

Section: Introductionsupporting

confidence: 89%

“…Hence, enough attention should be paid to reevaluate feasibility of the SPS technique for potential applications in MMCs. Regarding the key issue of interface engineering, the conventional VHP technique is definitively more feasible than the SPS technique to allow the unique -if any-diffusion-bonded interfacial state to be tailored, in the diamond/Al composite (at the micrometer scale) and in the SiC/Al composite (at the nanoscale) [21], in order to maximize the effectiveness of TC enhancement. In the SPS case, the TC enhancement is possible but less effective by only increasing the amount of diffusionbonded interface in the sample.…”

Section: Demonstration Of Macroscopic Thermal Gradients In Rapid Heating-cooling Mode Generated During Spsmentioning

confidence: 99%

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Tailoring interfacial bonding states of highly thermal performance diamond/Al composites: Spark plasma sintering vs. vacuum hot pressing

Tan

Addad

et al. 2016

Composites Part A: Applied Science and Manufacturing

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Interfacial configurations of the diamond/Al composites fabricated by vacuum hot pressing (VHP) and spark plasma sintering (SPS) have been investigated to evaluate feasibility of both techniques for tailoring interfacial bonding states, namely non-bonded, diffusion-bonded, partially and fully reaction-bonded interfaces. Multiscale interfacial characterization reveals that the unique diffusionbonded interface at the micrometer scale, being very favorable for enhancing global thermal conductivity (TC), has been achieved by conventional VHP technique due to its large processing window and homogenous thermal field. Comparatively, micrometer-scale and, even macroscopic (radial and axial) thermal gradients can be inevitably generated during the SPS process in rapid heating-cooling mode. As a result, the mixed interfacial bonding states have always been introduced in the SPSed samples which reduce the effectiveness of TC enhancement. The formation mechanisms of nanoscale interfacial Al 2 O 3 and Al 4 C 3 at the diamond/Al interface are also discussed.

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Section: Introductionsupporting

confidence: 89%

Section: Demonstration Of Macroscopic Thermal Gradients In Rapid Heating-cooling Mode Generated During Spsmentioning

confidence: 99%

Tailoring interfacial bonding states of highly thermal performance diamond/Al composites: Spark plasma sintering vs. vacuum hot pressing

Tan

Addad

et al. 2016

Composites Part A: Applied Science and Manufacturing

Self Cite

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“…It is vitally important to develop thermal management materials with high thermal conductivity (TC) and tailored coefficient of thermal expansion (CTE) values to minimize thermal stresses [1,2]. Metal matrix composites combining the high TC of metal and low CTE of the reinforcement can be suitable candidates for electronic packaging materials [3]. Recently, GFs-reinforced copper matrix composites have gained much attention due to their excellent thermal properties, low density, and good machinability.…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation of thermal conductivity of graphite flake/Cu composites with interfacial characteristics

Nan¹,

He²,

Zhang³

et al. 2023

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Graphite flake (GF)/Cu composites have received much attention as a promising thermal management material. This work provides a homogenization method to examine the effect of interfacial characteristics on the thermal conductivity of GFs/Cu composite. The finite element homogenization method is used to establish models of representative volume elements of material microstructure and interfacial layers, respectively, considering the distribution morphology and thermophysical properties of interface compositions. The interfacial layers are considered equivalent heat conduction materials, including interface compositions, pores, and Kapitza thermal resistances between compositions. The results of the thermal conductivity obtained by the approach were compared with the experimental results in the literature, and it shows good agreement. The results have indicated that the thermal conductivity of GFs/Cu composites is strongly affected by graphite sizes, graphite volume contents, interface contents, pore shapes, the relative density of interfacial layers, and whether the interface component is continuous has a significant influence.

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“…M. Chmielewski et al [ 11 ] investigated Cu-AlN metal matrix composites with a ceramic volume fraction between 0.1 and 0.4 prepared by a hot-pressing method in vacuum, the experimental results showed that 60Cu-40AlN composites exhibited a low CTE and high thermal conductivity coefficient of 10 × 10 −6 /K and 164.4 W/mK, respectively. Chen et al [ 12 ] fabricated SiC/Al composites with thermal conductivity of around 270 W/mK by a vacuum hot pressing (VHP) process at 655 °C. Wang et al [ 13 ] fabricated 3D-SiC/Al-Si-Mg interpenetrating composite (IPC) with three dimensional mutually interpenetrated structure by mold-forming and pressureless infiltration method.…”

Section: Introductionmentioning

confidence: 99%

Al2O3-Cu Substrate with Co-Continuous Phases Made by Powder Sintering Process

et al. 2018

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Ceramic-Al substrates with co-continuous ceramic and metal phases, which exhibit high thermal conductivity and compatible coefficient of thermal expansion (CTE), have been widely investigated through the process of die-casting. In this research, a kind of powder sintering process was proposed for fabricating ceramic-Cu composite substrates with co-continuous phases. Copper fiber (Cuf) has excellent thermal conductivity and large aspect ratio, making it an ideal material to form bridging network structures in the ceramic-Cu composite. To maintain the large aspect ratio of Cuf, and densify the composite substrate, ZnO-SiO2-CaO glass was introduced as a sintering additive. Both Al2O3/glass/Cuf and Al2O3/30glass/Cup composite substrates were hot-pressed at 850 °C under 25 MPa. Experimental results showed that the thermal conductivity of Al2O3/30glass/30Cuf composite substrate was as high as 38.9 W/mK, which was about 6 times that of Al2O3/30glass; in contrast, the thermal conductivity of Al2O3/30glass/30Cup composite substrate was only 25.9 W/mK. Microstructure observation showed that, influenced by hot press and corrosion of molten ZnO-SiO2-CaO glass, the copper fibers were deformed under hot-pressing, and some local melting-like phenomena occurred on the surface of copper fiber at 850 °C under 25 MPa. The molten phase originating from surface of Cuf welded the overlapping node of copper fibers during cooling process. Finally, the interconnecting metal bridging in ceramic matrix was formed and behaved as a rapid heat-dissipating channel, which is similar to substrates prepared through die-casting process by porous ceramic and melted Al.

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Effect of Interface Evolution on Thermal Conductivity of Vacuum Hot Pressed SiC/Al Composites

Cited by 21 publications

References 25 publications

Tailoring interfacial bonding states of highly thermal performance diamond/Al composites: Spark plasma sintering vs. vacuum hot pressing

Tailoring interfacial bonding states of highly thermal performance diamond/Al composites: Spark plasma sintering vs. vacuum hot pressing

Numerical simulation of thermal conductivity of graphite flake/Cu composites with interfacial characteristics

Al2O3-Cu Substrate with Co-Continuous Phases Made by Powder Sintering Process

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