High temperature sublimation behavior of antimony in CoSb3 thermoelectric material during thermal duration test

Zhao, Degang; Tian, Cuihua; Liu, Yunteng; Chen, Zhan; Chen, Lidong

doi:10.1016/j.jallcom.2010.11.204

Cited by 72 publications

(29 citation statements)

References 20 publications

(18 reference statements)

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“…CoSb 3 starts to oxidize after aging at 673 K in air, and various oxides such as Sb 2 O 3 , SbO 2 , CoSb 2 O 4 , and CoSb 2 O 6 are formed with increasing temperature. 11,12 Formation of these oxides leads to the degradation of thermoelectric properties. Generally, phase stability and resistance to oxidation are the most important factors for evaluating the thermal stability of the filled skutterudites for hightemperature applications.…”

Section: Introductionmentioning

confidence: 99%

Thermal Stability of La0.9Fe3CoSb12 Skutterudite

Shin

Kim

Park

et al. 2014

Journal of Elec Materi

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The thermal stability of the La 0.9 Fe 3 CoSb 12 skutterudite was examined by varying the aging conditions of temperature, time, and atmosphere (air and vacuum). Thermogravimetry, differential scanning calorimetry and x-ray diffraction analyses revealed that the La 0.9 Fe 3 CoSb 12 was significantly oxidized at temperatures above 673 K in air. The Sb-based oxides were preferably formed when aged at high temperatures in air. The thickness of the oxide layers was found to increase with increasing aging temperature and time, while the activation energy for the oxidation of the Fe-Sb-based skutterudite was lower than that of the Co-Sb-based skutterudites. However, when the analysis was performed in a vacuum, the La 0.9 Fe 3 CoSb 12 skutterudite was stable, and no oxide layers were observed after aging at 823 K for 100 h. These results suggest that a protective coating for the skutterudite materials or the encapsulated packaging of the skutterudite modules is required for hightemperature applications.

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Section: Introductionmentioning

confidence: 99%

Thermal Stability of La0.9Fe3CoSb12 Skutterudite

Shin

Kim

Park

et al. 2014

Journal of Elec Materi

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“…Annealing of CoSb Figure 7 shows the data of the quantitative analysis of the phase composition change in the films with the two-phase composition of (CoSb 3 + Sb) after annealing, determined using the ratio intensities of the diffraction lines for (012)Sb and (310)CoSb 3 , according to a previously reported method [9]. The process of Sb sublimation from antimonides also holds for the annealing of bulk materials [10].…”

Section: Resultsmentioning

confidence: 99%

Thermally Activated Processes of the Phase Composition and Structure Formation of the Nanoscaled Co–Sb Films

Shkarban

Peresunko

Pavlová

et al. 2016

Powder Metall Met Ceram

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It is investigated the formation of the phase composition and structure in the nanoscaled CoSb x (30 nm) (1.82 ≤ x ≤ 4.16) films deposited by the method of molecularbeam epitaxy on the substrates of the oxidated monocrystalline silicon at 200°C and following thermal treatment in vacuum in temperature range of 300-700°C. It is established that the films after the deposition are polycrystalline without texture. With increase in Sb content the formation of the phase composition in the films takes place in such sequence as this is provided by phase diagram for the bulky state of the Co-Sb system. At annealing in vacuum at temperature above 450-500°C a sublimation not only of the crystalline Sb phase but from the antimonides occurs. This is reflected on the phase composition change by following chemical reactions: CoSb 2 →(600 ∘ C) Sb↑= CoSb, CoSb 3 →(600 ∘ C) Sb↑=CoSb 2 ,CoSb 3 +Sb↑→(600 ∘ C) CoSb 3 and leads to increase in amount of the CoSb and CoSb 2 phases and decrease in amount of the CoSb 3 . CoSb x (30 nm) (1.8 < x < 4.16) films under investigation are thermostable up to ~350°C.

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“…For example, Isoda et al [13] tested the thermal shock resistance and thermo electric properties of boron doped iron disilicides. The grain-boundary crack, appeared in the initial period of thermal duration test of CoSb 3 thermoelectric material, was observed by Zhao et al [14]. Schmidt et al [15] studied the room-temperature mechanical properties and slow crack growth behaviour of Mg 2 Si, and Eilertsen et al [16] explored the fracture toughness of Co 4 Sb 12 and In 0.1 Co 4 Sb 12 thermoelectric skutterudites by three methods.…”

Section: Introductionmentioning

confidence: 98%

Electric and Heat Conductions Across a Crack in a Thermoelectric Material

Song¹,

Song²

2016

Journal of Theoretical and Applied Mechanics

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Abstract. The crack problem in a thermoelectric material is studied in this paper. Two kinds of crack surface conditions are discussed. The closed form solutions are derived, based on the complex variable method. The field intensity factors as well as the conversion efficiency are discussed in detail. The results show that the electric current density and thermal flux density exhibit traditional square-root singularity at the crack tip in case 1, while the electric current density has no singularity at the crack tip in case 2. It is proved due to the electric current flow and thermal flux separation, that the thermoelectric conversion efficiency can be higher than the maximum conversion efficiency of one-dimensional thermoelectric under the same temperature condition. In the numerical example, the conversion efficiency is increased by 29.6% as compared to the maximum conversion efficiency of one-dimensional thermoelectric.

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High temperature sublimation behavior of antimony in CoSb3 thermoelectric material during thermal duration test

Cited by 72 publications

References 20 publications

Thermal Stability of La0.9Fe3CoSb12 Skutterudite

Thermal Stability of La0.9Fe3CoSb12 Skutterudite

Thermally Activated Processes of the Phase Composition and Structure Formation of the Nanoscaled Co–Sb Films

Electric and Heat Conductions Across a Crack in a Thermoelectric Material

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