2008
DOI: 10.1002/pssc.200777475
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High temperature instabilities of ohmic contacts on p‐GaN

Abstract: This paper describes an investigation of the instabilities of ohmic contacts on p-type GaN submitted to long term high temperature stress. Transfer Length Method (TLM) was used to separately analyze the contribution of contact resistivity and sheet resistance on contact degradation. Before treatment, contacts showed linear behaviour, indicating good ohmic properties. On the other hand, thermal ageing at 250 ◦ C induced the degradation of electrical characteristics: in particular, (i) an increase of the contact… Show more

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“…where the effects on the electrical characteristic have been measured, and hydrogen has been supposed to be responsible for Mg passivation [29]. Figure 3 reports the band diagram of the p-GaN region adjacent to the contact: a potential barrier at the metal/p-GaN interface can be observed, with a height of about 2.2 eV and a width of about 10 nm.…”
Section: Modeling Of P-contact Degradationmentioning
confidence: 99%
“…where the effects on the electrical characteristic have been measured, and hydrogen has been supposed to be responsible for Mg passivation [29]. Figure 3 reports the band diagram of the p-GaN region adjacent to the contact: a potential barrier at the metal/p-GaN interface can be observed, with a height of about 2.2 eV and a width of about 10 nm.…”
Section: Modeling Of P-contact Degradationmentioning
confidence: 99%