High temperature enthalpy and heat capacity of GaN

Leitner, J.; Strejc, A.; Sedmidubský, David; Růžička, Květoslav

doi:10.1016/s0040-6031(02)00547-6

Cited by 62 publications

(38 citation statements)

References 5 publications

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“…The values of 300 = 170 W/m-K and = 1.44 for GaN [30]- [31] and 300, = 490 W/m-K, 300, = 390 W/m-K, and = 1.49 for 4H-SiC [32]- [33] were taken from the literature. The mass density ( = 6087 kg/m 3 [34], = 3220 kg/m 3 [35]) and specific heat values with their temperature dependencies were also taken from the literature [36]- [37]. The thermal boundary resistance (TBR) at the GaNSiC interface associated with the AlN nucleation layer was set to a constant value of 5 m 2 -K/GW, in agreement with recently reported values measured by time-domain thermal reflectance (TDTR) [30]- [31].…”

Section: Numerical Modelingmentioning

confidence: 99%

Experimental Characterization of the Thermal Time Constants of GaN HEMTs Via Micro-Raman Thermometry

Bagnall

Saadat

Joglekar

et al. 2017

IEEE Trans. Electron Devices

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Section: Numerical Modelingmentioning

confidence: 99%

Experimental Characterization of the Thermal Time Constants of GaN HEMTs Via Micro-Raman Thermometry

Bagnall

Saadat

Joglekar

et al. 2017

IEEE Trans. Electron Devices

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“…Table 1). Generally one can assess that different slopes of C p (T) curves at room temperature [24,27,28,66,67] are forerunners of often very strong discrepancies (up to an order of 5 J K À1 mol À1 ) between high-temperature heat capacities given in different publications [4,24,27,28,47,63,64,[66][67][68][69][70]. A more detailed discussion of the notorious discrepancies of the hightemperature heat capacity behavior of GaN is beyond the scope of the present study.…”

Section: Iii-v Materialsmentioning

confidence: 99%

Representative hybrid model used for analyses of heat capacities of group‐IV, III–V, and II–VI materials

Pässler

2010

Physica Status Solidi (b)

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Characteristic non-Debye features inherent to the dispersionrelated hybrid model, which had been devised for the sake of physically adequate representations of isobaric heat capacities of semiconductor and wide band gap materials, are demonstrated and discussed in some detail. We perform least-meansquare fittings of low-and high-temperature C p (T) data sets that are available for group-IV materials (diamond, Si, Ge, 3C-SiC), III-V materials (BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InP, InAs, InSb), and II-VI materials (ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe). The simulations of the C p (T) data sets under study, particularly with respect to the cryogenic region, are graphically represented, and existing data deficiencies are discussed. Important by-products of the fittings are presented within the frame of Supporting Information (online at: www.pss-b.com). There are given in tabulated form the characteristic phonon energies, e P (m), for integral orders, m ¼ À2, À1, 0, 1, 2, and 4, including further dispersion-related parameters like average phonon temperatures, Q P , dispersion coefficients, D P , and high-temperature limiting values of Debye temperatures, Q Dh (1). Furthermore, basing on comprehensive calculations of the C p (T) dependences from absolute zero up to room temperature, we provide representative values of entropies, S p (T), enthalpies, H p (T) À H p (0), and Gibbs free energies, G p (T) À G p (0), for the frequently considered reference point, T r ¼ 298.15 K, the accurate knowledge of which is indispensable for possible high-temperature continuations of these standard thermodynamic functions within the frame of the commonly used thermo-chemical formalism.

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“…However, among the five equations, the best results of PPV37 correlations have been obtained for the third-order polynomial (cubic) and Itagaki and Yamaguchi [21] equations. Meanwhile, the third-order polynomial (cubic), Itagaki and Yamguchi [21], and Leitner et al [22,23] Although the first-order polynomial equation showed the lowest regression for both PPV37 and PPV46 curves, the linear equation remains the simplest and most widely proposed equation to represent the relationship of the specific heat capacity and temperature [11,24]. The reason the linear equation has the lowest regression for PPV37 and PPV46 is mainly due to deviations in the melting states from 440 K to 480 K. The highest percentage errors of the first-order polynomial equation predictions for PPV37 (at 450 K) and PPV46 (at 480 K) were 4.45 % and 8.36 %, respectively.…”

Section: Resultsmentioning

confidence: 99%

“…Comparisons of experimental data for PPV37 with model equations (Chen et al[20]; Itagaki and Yamaguchi[21]; Leitner et al[22]) Comparisons of experimental data for PPV46 with model equations (Itagaki and Yamaguchi[21]; Leitner et al[22]; Chen et al[20])…”

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confidence: 99%

A Study of Specific Heat Capacity Functions of Polyvinyl Alcohol–Cassava Starch Blends

et al. 2010

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The specific heat capacity (C sp ) of polyvinyl alcohol (PVOH) blends with cassava starch (CSS) was studied by the differential scanning calorimetry method. Specimens of PVOH-CSS blends: PPV37 (70 mass% CSS) and PPV46 (60 mass% CSS) were prepared by a melt blending method with glycerol added as a plasticizer. The results showed that the specific heat capacity of PPV37 and PPV46 at temperatures from 330 K to 530 K increased from (2.963 to 14.995) J · g −1 · K −1 and (2.517 to 14.727) J · g −1 · K −1 , respectively. The specific heat capacity of PVOH-CSS depends on the amount of starch. The specific heat capacity of the specimens can be approximated by polynomial equations with a curve fitting regression >0.992. For instance, the specific heat capacity (in J · g −1 · K −1 ) of PPV37 can be expressed by C sp = −17.824 + 0.063T and PPV46 by C sp = −18.047 + 0.061T , where T is the temperature (in K).

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High temperature enthalpy and heat capacity of GaN

Cited by 62 publications

References 5 publications

Experimental Characterization of the Thermal Time Constants of GaN HEMTs Via Micro-Raman Thermometry

Experimental Characterization of the Thermal Time Constants of GaN HEMTs Via Micro-Raman Thermometry

Representative hybrid model used for analyses of heat capacities of group‐IV, III–V, and II–VI materials

A Study of Specific Heat Capacity Functions of Polyvinyl Alcohol–Cassava Starch Blends

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