High Temperature Electronics

McCluskey, F. Patrick; Podlesak, T.F.; Grzybowski, Richard

doi:10.1201/9780203751978

Cited by 21 publications

(20 citation statements)

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“…The motivation for thermal management in semiconductors is comparable with that of motors. At temperatures approach their upper operation limit, semiconductor devices typically exhibit decreased functionality and efficiency, producing less desirable power output per input, and then total loss of functionality [42,43]. Mechanical fatigue considerations in semiconductor packages are similar to that for motors, in which thermal cycling fatigue occurs due to bonded ceramic, metallic, and polymer materials with vastly differing coefficients of thermal expansion [42].…”

Section: Lessons From High-performance Electronicsmentioning

confidence: 99%

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Deisenroth

Ohadi

2019

Energies

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Enhanced cooling, coupled with novel designs and packaging of semiconductors, has revolutionized communications, computing, lighting, and electric power conversion. It is time for a similar revolution that will unleash the potential of electrified propulsion technologies to drive improvements in fuel-to-propulsion efficiency, emission reduction, and increased power and torque densities for aviation and beyond. High efficiency and high specific power (kW/kg) electric motors are a key enabler for future electrification of aviation. To improve cooling of emerging synchronous machines, and to realize performance and cost metrics of next-generation electric motors, electromagnetic and thermomechanical co-design can be enabled by innovative design topologies, materials, and manufacturing techniques. This paper focuses on the most recent progress in thermal management of electric motors with particular focus on electric motors of significance to aviation propulsion.

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Section: Lessons From High-performance Electronicsmentioning

confidence: 99%

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Deisenroth

Ohadi

2019

Energies

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“…These hot spots prevent the device from operating at peak performance, as well as cause early device failure. In addition, with transient operating temperatures of 175 °C and above, and with elevated current density levels, the formation of brittle intermetallic phases occurs when the device surface and wire bonds are dissimilar metals, 5 which is the case for the devices in this report.…”

Section: Fig 4 Computer-aided Design Layout Of Conceived Package Impmentioning

confidence: 78%

Alternative Solder Bond Packaging Approach for High-Voltage (HV) Pulsed Power Devices

Ogunniyi¹,

Koebke²,

O'Brien³

et al. 2016

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“…During thermal aging, the microstructure changes significantly particularly the Intermetallic compounds (IMCs) which have great contribution in the reliability of any soldered joint under the service conditions (Wang et al, 2014). Because the operating temperature of many new electronic systems could be as high as 150ºC to 200ºC, like electronics in oil and gas exploration, avionics, automotive industry, and defense applications typically have more demanding thermal life cycle environments than consumer electronics (McCluskey et al, 1996). These demanding high-temperature conditions of use, together with the need for greater reliability of all electronic systems motivate further research on the effects of high-temperature aging of solder materials (Anderson and Harringa, 2004).…”

Section: Introductionmentioning

confidence: 99%

Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature

Aamir

Tolouei‐Rad

Din

et al. 2019

SSMT

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Purpose Tin-Silver-Copper is widely accepted as the best alternative to replace Tin-Lead solders in microelectronics packaging due to their acceptable properties. However, to overcome some of the shortcomings related to its microstructure and in turn, its mechanical properties at high temperature, the addition of different elements into Tin-Silver-Copper is important for investigations. The purpose of this paper is to analyse the effect of lanthanum doping on the microstructure, microhardness and tensile properties of Tin-Silver-Copper as a function of thermal aging time for 60, 120 and 180 h at a high temperature of 150°C and at high strain rates of 25, 35 and 45/s. Design/methodology/approach The microstructure of un-doped and Lanthanum-doped Tin-Silver-Copper after different thermal aging time is examined using scanning electron microscopy followed by digital image analyses using ImageJ. Brinell hardness is used to find out the microhardness properties. The tensile tests are performed using the universal testing machine. All the investigations are done after the above selected thermal aging time at high temperature. The tensile tests of the thermally aged specimens are further investigated at high strain rates of 25, 35 and 45/s. Findings According to the microstructural examination, Tin-Silver-Copper with 0.4 Wt.% Lanthanum is found to be more sensitive at high temperature as the aging time increases which resulted in coarse microstructure due to the non-uniform distribution of intermetallic compounds. Similarly, lower values of microhardness, yield strength and ultimate tensile strength come in favours of 0.4 Wt.% Lanthanum added Tin-Silver-Copper. Furthermore, when the thermally aged tensile specimen is tested at high strains, two trends in tensile curves of both the solder alloys are noted. The trends showed that yield strength and ultimate tensile strength increase as the strain rate increase and decrease when there is an increase in thermal aging. Originality/value The addition of higher supplement (0.4 Wt.%) of Lanthanum into Tin-Silver-Copper showed a lower hardness value, yield strength, ultimate tensile strength, ductility, toughness and fatigue in comparison to un-doped Tin-Silver-Copper at high temperature and at high strain rates. Finally, simplified material property models with minimum error are developed which will help when the actual test data are not available.

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High Temperature Electronics

Cited by 21 publications

References 0 publications

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Alternative Solder Bond Packaging Approach for High-Voltage (HV) Pulsed Power Devices

Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature

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