2009
DOI: 10.1364/oe.17.021986
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High-speed modulation of a compact silicon ring resonator based on a reverse-biased pn diode

Abstract: High speed modulation based on a compact silicon ring resonator operating in depletion mode is demonstrated. The device exhibits an electrical small signal bandwidth of 19 GHz. The device is therefore a candidate for highly compact, wide bandwidth modulators for a variety of applications.

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Cited by 165 publications
(82 citation statements)
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“…The first designs of this type were demonstrated in 2008 [21][22][23], and since then there have been numerous versions published with different variants in the design [24][25][26][27][28][29][30][31][33][34][35][36][37]. The most straightforward form of the device has the pn junction positioned in the waveguide equidistant from the rib edges [25][26][27][28][29][30][31][32].…”
Section: Chirpmentioning
confidence: 99%
“…The first designs of this type were demonstrated in 2008 [21][22][23], and since then there have been numerous versions published with different variants in the design [24][25][26][27][28][29][30][31][33][34][35][36][37]. The most straightforward form of the device has the pn junction positioned in the waveguide equidistant from the rib edges [25][26][27][28][29][30][31][32].…”
Section: Chirpmentioning
confidence: 99%
“…Therefore we have investigated the resistance of shallow trenches ͑etch depth= 135 nm, i.e., 85 nm remaining, and different lengths͒ typically used to define rib waveguide based ring resonators. 11 The values of ␦ were determined from the slope of a resistance-width plot, but ␦ now refers to the surface rather than the sidewall depletion layer. As shown in Fig.…”
Section: Electrical Conduction and Optical Properties Of Doped Silicomentioning
confidence: 99%
“…Its position is critical to the performance of modulator since the frequency response is limited by the RC cut off frequency resulting from capacitive effects within the junction and the resistance of the doped regions and metal contacts [21]. Then the sample was covered by a 1.1 μm thick SiO2 layer using plasma-enhanced chemical vapor deposition (PECVD), see Figure 5(d).…”
Section: Fig 5 Fabrication Process Of Modulatormentioning
confidence: 99%