Abstract:Printed electronics is an alternative manufacturing paradigm for low-cost and large-area microelectronic devices and systems. Metal nanoparticle (MNP) inks are favorable to print conductors due to their high electrical conductivity. As-printed MNP ink requires sintering to become electrically conductive. High-quality MNP conductors require monitoring and optimization of the sintering process. Traditionally, electrical conductivity is measured to monitor the different sintering stages. This requires destructive… Show more
“…Furthermore, this type of sintering is not compatible with the thermal stability of commonly used inexpensive polymer foils (e.g. PET or PEN) [43,44].…”
Section: Photonics Sinteringmentioning
confidence: 99%
“…SP and OP measure an area of a few cm in a short time frame. SP is mostly used for thickness measurements, while OP can also be applied for surface roughness characterization [33,37,40,44,60,66,89,92,93].…”
Section: Post-printing Characterizationmentioning
confidence: 99%
“…Frequency-domain thermoreflectance (FDTR) is based on measuring the thermal conductivity of conductive layers, which are heated with infrared radiation [44]. Figure 27 illustrates a possible application of FDTR-assisted R2R production.…”
Section: Thermographymentioning
confidence: 99%
“…Thus, the thermal phase of the pump laser is recorded. The phase information is then fitted to a thermal model to extract the thermal properties of the samples related to their conductivity [44].…”
Section: Thermographymentioning
confidence: 99%
“…This value can be used to make decisions on the quality of sintering. Reprinted with permission from [44].…”
Over the past decade, printed electronics (PE) has shown great potential for a wide range of industries, from consumer goods, electronics, aerospace, automotive, pharmaceutical, biomedical, to textiles and fashion. The rapid development of printing technology has been strongly driven by the growth of the PE market and its many applications. Here, we review the latest trends in PE production quality control, focusing on emerging technologies such as terahertz spectroscopy, which may play a key role in the development of smart manufacturing of PE devices in the near future. We also provide a comparison with conventional quality control technologies or off-line measurements, such as four-point probe measurements, atomic force microscopy, optical microscopy, etc.
“…Furthermore, this type of sintering is not compatible with the thermal stability of commonly used inexpensive polymer foils (e.g. PET or PEN) [43,44].…”
Section: Photonics Sinteringmentioning
confidence: 99%
“…SP and OP measure an area of a few cm in a short time frame. SP is mostly used for thickness measurements, while OP can also be applied for surface roughness characterization [33,37,40,44,60,66,89,92,93].…”
Section: Post-printing Characterizationmentioning
confidence: 99%
“…Frequency-domain thermoreflectance (FDTR) is based on measuring the thermal conductivity of conductive layers, which are heated with infrared radiation [44]. Figure 27 illustrates a possible application of FDTR-assisted R2R production.…”
Section: Thermographymentioning
confidence: 99%
“…Thus, the thermal phase of the pump laser is recorded. The phase information is then fitted to a thermal model to extract the thermal properties of the samples related to their conductivity [44].…”
Section: Thermographymentioning
confidence: 99%
“…This value can be used to make decisions on the quality of sintering. Reprinted with permission from [44].…”
Over the past decade, printed electronics (PE) has shown great potential for a wide range of industries, from consumer goods, electronics, aerospace, automotive, pharmaceutical, biomedical, to textiles and fashion. The rapid development of printing technology has been strongly driven by the growth of the PE market and its many applications. Here, we review the latest trends in PE production quality control, focusing on emerging technologies such as terahertz spectroscopy, which may play a key role in the development of smart manufacturing of PE devices in the near future. We also provide a comparison with conventional quality control technologies or off-line measurements, such as four-point probe measurements, atomic force microscopy, optical microscopy, etc.
The roughness of 3D‐printed surfaces poses a challenge when integrating fused filament fabrication (FFF) printing with printed electronics, leading to inconsistencies and breaks in the circuit traces. To improve the surface roughness, we propose an ironing toolpath. The ironing toolpath involves the hot nozzle going over the printed surface with finer line spacing, remelting the surface to fill gaps, and creating a smooth finish. For further optimization, various ironing parameters are investigated including flow, speed, line spacing, and temperature. A wide range of materials is tested, including commonly used low‐temperature filaments (PLA, PETG, ABS) and high‐temperature filaments (PSU, PEI, PEEK) suitable for integration with printed electronics and medical applications. To collect the extensive datasets an automated measurement system is deployed. With this method, surface roughness reductions of up to 96.6% are achieved and significant trends are identified. Lastly, the integration of 3D printing with electronics is demonstrated by printing a high‐resolution strain gauge structure on top of an ironed surface and embedding it into fully printed tweezers which could be used in medical robotics. The insights on ironing extend beyond electronics and can also be valuable in other areas where low surface roughness of FFF‐printed parts is required.This article is protected by copyright. All rights reserved.
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