Abstract:The structure of dissociated screw dislocations in GaAs is analyzed by high‐resolution electron microscopy and image simulation. The stacking fault is invariably found to be intrinsic with a stacking‐fault energy of (45 ± 6) mJ/m2. The comparison between experimental and simulated images suggests that partial dislocation motion occurs during observation and the interaction of the dislocation core with point defects severely limits the determination of the dislocation core structure in terms of “glide” or “shuf… Show more
“…While most analyses of quantitative high-resolution microscopy were primarily concerned with distinguishing glide and shuffle set dislocations, i.e. discriminating whether dislocation cores lie on the narrowly or widely spaced {111} planes by interpreting characteristic contrast features in their vicinity [46][47][48], it is only recently that efforts have been made to investigate the core structure of 30 and 90 partials, both by theoretically applying ab initio calculations [49][50][51] and experimentally employing advanced electron microscopy techniques [53,53].…”
With improvements in the instrumental information limit and the simultaneous minimization of image delocalization, high-resolution transmission electron microscopy is presently enjoying increased popularity for the atomic-scale imaging of lattice imperfections in solid-state materials. In this study, the benefits of a combination of spherical aberration-corrected imaging and numerical retrieval of the exit-plane wavefunction from a focal series of micrographs are illustrated by highlighting their combined use for atomic-scale characterization of lattice defects frequently observed in common semiconductor materials. Thus, experimental analyses will review the core structure of Lomer dislocations at In 0.3 Ga 0.7 As/GaAs heterointerfaces and focus on atomic lattice displacements associated with extrinsic stacking faults in GaAs, as well as on the core structure of chromium implantation-induced Frank partial dislocations in GaN at directly interpretable contrast features. Supplementary, practical advantages of the retrieval of the exit-plane wavefunction for the subsequent numerical elimination of residual lens aberrations are demonstrated.
“…While most analyses of quantitative high-resolution microscopy were primarily concerned with distinguishing glide and shuffle set dislocations, i.e. discriminating whether dislocation cores lie on the narrowly or widely spaced {111} planes by interpreting characteristic contrast features in their vicinity [46][47][48], it is only recently that efforts have been made to investigate the core structure of 30 and 90 partials, both by theoretically applying ab initio calculations [49][50][51] and experimentally employing advanced electron microscopy techniques [53,53].…”
With improvements in the instrumental information limit and the simultaneous minimization of image delocalization, high-resolution transmission electron microscopy is presently enjoying increased popularity for the atomic-scale imaging of lattice imperfections in solid-state materials. In this study, the benefits of a combination of spherical aberration-corrected imaging and numerical retrieval of the exit-plane wavefunction from a focal series of micrographs are illustrated by highlighting their combined use for atomic-scale characterization of lattice defects frequently observed in common semiconductor materials. Thus, experimental analyses will review the core structure of Lomer dislocations at In 0.3 Ga 0.7 As/GaAs heterointerfaces and focus on atomic lattice displacements associated with extrinsic stacking faults in GaAs, as well as on the core structure of chromium implantation-induced Frank partial dislocations in GaN at directly interpretable contrast features. Supplementary, practical advantages of the retrieval of the exit-plane wavefunction for the subsequent numerical elimination of residual lens aberrations are demonstrated.
Transmission electron microscopy is used to determine the dissociation width of extended dislocations in n‐, si‐, and p‐GaAs. Results obtained by high‐resolution transmission electron microscopy (HRTEM) and the weak‐beam technique (WB) are compared. Reasons for the differences between the results obtained from WB and HRTEM and their influence on the determination of the stacking‐fault energy are discussed. The results are compared with previous investigations, which show a wide scatter of results despite the fact, that the stacking‐fault energy is an intrinsic material property. A number of parameters, such as the defect used for the determination, localization of the partial‐dislocation cores and the electrical characteristics of the material are considered to explain the discrepancies.
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