High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Effect of processing parameters on fracture toughness of lead-free solder joints

“…10b) displayed a more ductile fracture surface that was consistent with a lower Ag content then that of SAC305 (3% Ag) (Fig. 10a) [13,14,[17][18][19].…”

“…Ball impact tests of SAC105 and SAC405 with a Ni/Au pad finish showed that the latter was weaker as it underwent more brittle fracture [14]. SAC solders with a silver content of 3% were reported to give good thermal cycling reliability, but poor drop reliability [13,17]. According to [18,19], higher strain rates and Ag content corresponded to a shift from bulk solder failure to more interface failure.…”

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

“…A large number of research and review papers described the impact of dopants on the microstructure and physical properties of SAC solders in the liquid and/or solid state [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20]. It was shown that minor insertions of additional elements modify the microstructure and improve different properties of SAC alloys.…”

The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

“…However, the Ag content of Sn-Ag-Cu solders has attracted much attention over the past few years because it has been shown that low-silver-content Sn-Ag-Cu interconnections perform better under drop loading conditions as compared with near-eutectic Sn-Ag-Cu compositions (see, e.g., Refs. [62][63][64][65][66][67].…”