High precision self-alignment using liquid surface tension for additively manufactured micro components

Overton, James; Kinnell, Peter; Lawes, Simon; Ratchev, Svetan

doi:10.1016/j.precisioneng.2014.12.004

Cited by 5 publications

(5 citation statements)

References 37 publications

(39 reference statements)

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“…In a couple of reviews Mastrangeli et al covered self‐assembly, self‐packaging, and self‐alignment of microelectronic components using 2D shape matching or, as demonstrated by Overton et al, 3D topography matching using surface tension, which can be assisted by the agitation of components in a liquid carrier or by applying electromagnetic fields. These small‐scale components can be processed into complex architectures in a parallel self‐assembly manner using the surface tension approach, which is nowadays even employed in industrial routines to manufacture electronics.…”

Section: Self‐assembly Driving Mechanisms and Materials Platformsmentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

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simple transistors and logics to highly integrated microcontrollers and displays, the latter of which utilizes some of the most technologically advanced processes available in the industry. [3] The success of these technologies has been achieved through enhanced integration of various active functional blocks such as transistors, digital logics, and analog circuits, along with advances in miniaturization and simplification of the overall manufacturing process, eventually leading to large scale, parallel fabrication of silicon chip-based microelectronic components and systems. [4,5] However, many of the manufacturing steps in assembling these electronic components remain either semiparallel or sequential in nature, including processes as dicing, pick and place, packaging, and final assembly of the device. Each additional sequential step increases costs and should ideally be avoided, however substantial streamlining is not always feasible in complex manufacturing processes. [6] More critically, highly integrated silicon-based devices still require several external supporting components for their operation such as wiring, powering, sensing, and communications that cannot be easily integrated within the planar surface of a silicon die. Thus, sensors, actuators, capacitors, coils, antennas, and optics, each crucial for the complete system, are typically placed separately from the silicon chip onto a printed circuit board (PCB), or integrated within another package (Figure 1a). While the need for ever decreasing sizes has demanded tremendous investments and efforts in the manufacture of completed assemblies, the miniaturizing of 3D electronic components (Figure 1b) and systems has nevertheless reached the range of mesoscopic sizes (<1 mm) where the manufacture and assembly of components experience challenges with respect to yield, costs, and reliability. [7] As a result, these issues limit the fabrication potential and commercial viability of components and systems to scales around 1 mm, [8] and despite efforts to improve the planar construction of mesoscopic 3D devices, the results are seen as inefficient and experience difficulties in achieving high performances while maintaining reasonable complexity. Despite the great success in manufacturing active electronics, such concerns are strongly related to the fabrication of passive electronic components like inductors, capacitors, antennas, and resonators where material properties (e.g., mechanical, magnetic, and electrical) and geometry play a crucial role. [8,9] In order to downscale these devices further and improve integration with active electronics, novel fabrication strategies are required.Electronic devices and their components are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring the state-of-the-art manufacturing and materials to do so. An emerging class of materials and fabrication techniques inspired by self-assembling biological systems shows promise as an alternative to the more traditional m...

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Section: Self‐assembly Driving Mechanisms and Materials Platformsmentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

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Section: Resultsmentioning

confidence: 99%

“…Surface tension (SFT) is the tension of the surface layer of the liquid that acts on any interface line along the surface due to the gravitational imbalance between the molecules. 41 The silk fibroin molecular chain contains both hydrophilic segments and hydrophobic segments, so it is a good surfactant material. Comparing the surface tension of the HSF and SF solutions at different concentrations, the content of the hydrophilic/hydrophobic groups in each solution can be demonstrated.…”

Section: Scanning Electron Microscopy (Sem)mentioning

confidence: 99%

Tunable High-Molecular-Weight Silk Fibroin Polypeptide Materials: Fabrication and Self-Assembly Mechanism

Jiang

Zhao

et al. 2020

ACS Appl. Bio Mater.

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Silk fibroin is a multisegment natural protein composed of a heavy (H) chain, a light (L) chain and a P25 glycoprotein chain. Herein, we developed a dialysis separation technique under reducing conditions to break the disulfide bond between the H-chain and L-chain and remove the low-molecular-weight portions of the protein. Thus, a high-molecularweight silk fibroin polypeptide (HSF) material was obtained. SDS-PAGE electrophoresis showed that the molecular weight of HSF was over 80 kDa, similar to the size of the silk fibroin H-chain. Amino acid analysis result demonstrated that the amino acid composition of HSF was almost identical to that of H-chain composition. Importantly, the HSF material obtained has a high surface activity, which can reduce the surface tension of water to below 20 mN/m; at high temperature and high concentration, it can also form a unique nanofibrous network with a lamellar crystalline structure. HSF can further form a rod-shaped structure in a strong polar environment and become a star-shaped fibrous network in a weak polar environment. When the pH value of HSF solution was adjusted from 6 to 8, a structural transition from a folded crank sheet-like structure with micellar beads to a ring-like fibrous structure was observed. During the conversion of HSF from colloidal particles to nanofibers, its molecular conformation also transformed from random coils to β-sheets. These tunable properties indicate that HSF materials have a wide range of applications in biomedical and green chemistry fields.

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“…Micromanipulation requires tools to accurately manipulate objects and multi-axis positioners to move the tool to an appropriate position and orientation with a sub-micrometer resolution. Various tools have been developed, such as vacuum nozzles [ 8 ], microtweezers with force sensors [ 4 , 9 ], and grippers that use capillary force [ 10 , 11 ]. Regarding the multi-axis positioner, the combination of a single-axis stage driven by linear synchronous motors with linear guides and stepping motors with ball-screw mechanisms are widely used in the industry [ 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Precise Position Control of Holonomic Inchworm Robot Using Four Optical Encoders

et al. 2023

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In this study, an XYθ position sensor is designed/proposed to realize the precise control of the XYθ position of a holonomic inchworm robot in the centimeter to submicrometer range using four optical encoders. The sensor was designed to be sufficiently compact for mounting on a centimeter-sized robot for closed-loop control. To simultaneously measure the XYθ displacements, we designed an integrated two-degrees-of-freedom scale for the four encoders. We also derived a calibration equation to decrease the crosstalk errors among the XYθ axes. To investigate the feasibility of this approach, we placed the scale as a measurement target for a holonomic robot. We demonstrated closed-loop sequence control of a star-shaped trajectory for multiple-step motion in the centimeter to micrometer range. We also demonstrated simultaneous three-axis proportional–integral–derivative control for one-step motion in the micrometer to sub-micrometer range. The close-up trajectories were examined to determine the detailed behavior with sub-micrometer and sub-millidegree resolutions in the MHz measurement cycle. This study is an important step toward wide-range flexible control of precise holonomic robots for various applications in which multiple tools work precisely within the limited space of instruments and microscopes.

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High precision self-alignment using liquid surface tension for additively manufactured micro components

Cited by 5 publications

References 37 publications

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Tunable High-Molecular-Weight Silk Fibroin Polypeptide Materials: Fabrication and Self-Assembly Mechanism

Precise Position Control of Holonomic Inchworm Robot Using Four Optical Encoders

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