High power SiC inverter module packaging solutions for junction temperature over 220&amp;#x00B0;C

Woo, Daniel Rhee Min; Yuan, Hwang How; Li, Jerry Aw Jie; Ling, Ho Siow; Bum, Lee Jong; Zhang, Songbai

doi:10.1109/eptc.2014.7028383

Cited by 20 publications

(6 citation statements)

References 3 publications

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“…Other packaging technologies have been investigated in search of a more compact high temperature operation. Flip chip technologies present a compact wireless configuration [188–191] but reservations exist over its mechanical stability and mechanical stress at high temperatures [143, 192]. FCOC substrates [193] have also been reported to reduce stress between solder joints, devices and substrates.…”

Section: Packaging Of Power Electronics Modulementioning

confidence: 99%

Integrated motor drives: state of the art and future trends

Abebe

Vakil

Calzo

et al. 2016

IET Electric Power Applications

128

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With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented.

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Section: Packaging Of Power Electronics Modulementioning

confidence: 99%

Integrated motor drives: state of the art and future trends

Abebe

Vakil

Calzo

et al. 2016

IET Electric Power Applications

128

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“…Inverters need to withstand a considerable amount of current in EVs, which leads to a substantial amount of heat generation and a harsh operating temperature of above 200 • C [2,3]. Given that Si-based semiconductors become conductive and can fail at such high temperatures, wide-bandgap (WBG) semiconductors are better suited for use in inverter power chips because of their superior properties compared to Si-based semiconductors [4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices

2022

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Sintered silver paste is widely used as the die-attachment material for power semiconductors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments. These lead to the deterioration of the die-attachment joints. In this paper, a novel method of sintering silver joints is demonstrated, where silver–indium alloy paste is used to improve the reliability of sintered Ag joints. The silver–indium (Ag–In) alloy paste was fabricated through mechanical alloying using the ball-milling technique. The well-bonded sintered Ag–In alloy joints inhibited pore coarsening better than pure sintered Ag joints and significantly enhanced the mechanical properties at high operating temperatures. Lastly, an oxidation mechanism for the sintered joint was proposed, and strategies to prevent such high-temperature oxidation were discussed.

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“…This is the case of the modules presented in [11], [12], [13], [14]. In some other cases, a single ceramic substrate is used, and electrical isolation is provided through one side only [15], although heat can be extracted through both sides of the package.…”

Section: Introductionmentioning

confidence: 99%

Packaging with Double-Side Cooling Capability for SiC Devices, Based on Silver Sintering

Buttay

Riva

Allard

et al. 2018

IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society

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Although they can operate at high temperature, SiC devices require efficient thermal management. One solution is to use a dual-side cooling packaging, where heat can be extracted through two surfaces. Here, such a package is presented, using only materials which can operate at high temperature (>200°C): ceramic substrates, silver sintering, fluorinated parylene. Due to the small feature size of the SiC dies used, a special care is given on the etching resolution of the substrates. The complete manufacturing process is presented, and some characterization results are given to demonstrate that the package is operational.

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High power SiC inverter module packaging solutions for junction temperature over 220°C

Cited by 20 publications

References 3 publications

Integrated motor drives: state of the art and future trends

Integrated motor drives: state of the art and future trends

Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices

Packaging with Double-Side Cooling Capability for SiC Devices, Based on Silver Sintering

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