High power pulsed magnetron sputtering: A review on scientific and engineering state of the art

Sarakinos, Kostas; Alami, Jones; Konstantinidis, Stéphanos

doi:10.1016/j.surfcoat.2009.11.013

Cited by 922 publications

(545 citation statements)

References 131 publications

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“…3. The higher energies of polyester sputtered with 60 amps may promote a faster migration of the Cu particles compared to HIPIMS at 6 amps (Sarakinos et al 2010). Also, a local softening of the fibers at the contact sites takes place at a higher sputtering energy, and this may play a significant role in the inactivation time of E. coli when sputtering with high currents as compared to lower currents due to the effect of higher temperatures available to the substrate (Perelshtein et al 2009) Cu ions and Ar ions composition sputtered by HIPIMS and DCMS derived from mass spectroscopy analysis Figure 5 presents the ion composition when sputtering from the same Cu target by DCMS and HIPIMS in Ar, derived from mass spectroscopy analysis.…”

Section: Resultsmentioning

confidence: 99%

“…Wet methods to deposit Cu on fabrics produced films with low uniformity and poor adherence (Torres et al 2010;Yuranova et al 2006), and this moved us to use techniques depositing meta/metal ions with higher energy presenting an acceptable film uniformity (Mejía et al 2010) HIPIMS proceeds with a higher density of electrons/metal ion pairs and at higher energies compared to DCMS and DCMSP (Ehiasarian et al 2008;Lin et al 2010;Sarakinos et al 2010) The Cu-loading necessary in the Cu films sputtered by HIPIMS to inactivate Escherichia coli was about three times lower compared to DCMS-sputtered films (Kusiak-Nejman et al 2011). This indicates a substantial Cu metal savings within the preparation of antibacterial films.…”

Section: Introductionmentioning

confidence: 99%

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Inactivation of bacteria under visible light and in the dark by Cu films. Advantages of Cu-HIPIMS-sputtered films

Ehiasarian

Pulgarín

Kiwi

2012

Environ Sci Pollut Res

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Introduction The Cu polyester thin-sputtered layers on textile fabrics show an acceptable bacterial inactivation kinetics using sputtering methods. Materials and methods Direct current magnetron sputtering (DCMS) for 40 s of Cu on cotton inactivated Escherichia coli within 30 min under visible light and within 120 min in the dark. For a longer DCMS time of 180 s, the Cu content was 0.294% w/w, but the bacterial inactivation kinetics under light was observed within 30 min, as was the case for the 40-s sputtered sample. Results and discussion This observation suggests that Cu ionic species play a key role in the E. coli inactivation and these species were further identified by X-ray photoelectron spectroscopy (XPS). The 40-s sputtered samples present the highest amount of Cu sites held in exposed positions interacting on the cotton with E. coli. Cu DC magnetron sputtering leads to thin metallic semi-transparent gray-brown Cu coating composed by Cu nanoparticulate in the nanometer range as found by electron microscopy (EM). Cu cotton fabrics were also functionalized by bipolar asymmetric DCMSP. ConclusionSputtering by DCMS and DCMSP for longer times lead to darker and more compact Cu films as detected by diffuse reflectance spectroscopy and EM. Cu is deposited on the polyester in the form of Cu 2 O and CuO as quantified by XPS. The redox interfacial reactions during bacterial inactivation involve changes in the Cu oxidation states and in the oxidation intermediates and were followed by XPS. High-power impulse magnetron sputtering (HIPIMS)-sputtered films show a low rugosity indicating that the texture of the Cu nanoparticulate films were smooth. The values of R q and R a were similar before and after the E. coli inactivation providing evidence for the stability of the HIPIMSdeposited Cu films. The Cu loading percentage required in the Cu films sputtered by HIPIMS to inactivate E. coli was about three times lower compared to DCMS films. This indicates a substantial Cu metal savings within the preparation of antibacterial films.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Inactivation of bacteria under visible light and in the dark by Cu films. Advantages of Cu-HIPIMS-sputtered films

Ehiasarian

Pulgarín

Kiwi

2012

Environ Sci Pollut Res

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“…HiPIMS can be set up on a conventional magnetron sputtering system by changing power supplies making it possible to deliver high power pulses to the magnetron in the range of a few kilowatts per square centimeter while keeping the time-averaged power on a DCMS level of typically watts per square centimeter to avoid damaging the magnetron. 18 Such a HiPIMS discharge pulse is shown in Fig. 1.…”

Section: Process Conditionsmentioning

confidence: 99%

“…The aim has been to provide a good introduction to this novel technique for PVD process engineers and researchers on thin films, who are familiar with the sputtering basics, without any claims on completely covering the whole field of HiPIMS. More details on the fundamentals and applications of HiPIMS can be found in the review articles by Helmersson et al, 5 Sarakinos et al, 18 and Anders. 6 Furthermore, it should also be brought to the readers' attention that parts of the current review concerning thin film processing are based on a recent review paper by Sarakinos et al 18 Moreover, in this work, much attention has been paid to different industrially relevant material systems owing to the fact that they are after all the ultimate goal of any thin film deposition process.…”

Section: Introductionmentioning

confidence: 99%

An introduction to thin film processing using high-power impulse magnetron sputtering

2012

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High-power impulse magnetron sputtering (HiPIMS) is a promising sputtering-based ionized physical vapor deposition technique and is already making its way to industrial applications. The major difference between HiPIMS and conventional magnetron sputtering processes is the mode of operation. In HiPIMS the power is applied to the magnetron (target) in unipolar pulses at a low duty factor (andlt;10%) and low frequency (andlt;10 kHz) leading to peak target power densities of the order of several kilowatts per square centimeter while keeping the average target power density low enough to avoid magnetron overheating and target melting. These conditions result in the generation of a highly dense plasma discharge, where a large fraction of the sputtered material is ionized and thereby providing new and added means for the synthesis of tailor-made thin films. In this review, the features distinguishing HiPIMS from other deposition methods will be addressed in detail along with how they influence the deposition conditions, such as the plasma parameters and the sputtered material, as well as the resulting thin film properties, such as microstructure, phase formation, and chemical composition. General trends will be established in conjunction to industrially relevant material systems to present this emerging technology to the interested reader.Funding Agencies|Swedish Research Council (VR)|623-2009-7348

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“…HiPIMS can be used to obtain increased adhesion between coating and its substrate (Sarakinos et al, 2010). In order to assess the mechanical properties and the durability of the coatings, hardness and elastic modulus were studied by nanoindentation, while cohesive and adhesive failure were investigated with micro scratching.…”

Section: Introductionmentioning

confidence: 99%

Mechanical and tribological behavior of silicon nitride and silicon carbon nitride coatings for total joint replacements

Pettersson

Tkachenko

Schmidt

et al. 2013

Journal of the Mechanical Behavior of Biomedical Materials

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Total joint replacements currently have relatively high success rates at 10–15 years; however, increasing ageing and an active population places higher demands on the longevity of the implants. A wear resistant configuration with wear particles that resorb in vivo can potentially increase the lifetime of an implant. In this study, silicon nitride (SixNy) and silicon carbon nitride (SixCyNz) coatings were produced for this purpose using reactive high power impulse magnetron sputtering (HiPIMS). The coatings are intended for hard bearing surfaces on implants. Hardness and elastic modulus of the coatings were evaluated by nanoindentation, cohesive, and adhesive properties were assessed by micro-scratching and the tribological performance was investigated in a ball-on-disc setup run in a serum solution. The majority of the SixNy coatings showed a hardness close to that of sintered silicon nitride (∼18 GPa), and an elastic modulus close to that of cobalt chromium (∼200 GPa). Furthermore, all except one of the SixNy coatings offered a wear resistance similar to that of bulk silicon nitride and significantly higher than that of cobalt chromium. In contrast, the SixCyNz coatings did not show as high level of wear resistance.

Funding Agencies|Swedish Foundation for Strategic Research (SSF)||VINNOVA||Swedish Institute||

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High power pulsed magnetron sputtering: A review on scientific and engineering state of the art

Cited by 922 publications

References 131 publications

Inactivation of bacteria under visible light and in the dark by Cu films. Advantages of Cu-HIPIMS-sputtered films

Inactivation of bacteria under visible light and in the dark by Cu films. Advantages of Cu-HIPIMS-sputtered films

An introduction to thin film processing using high-power impulse magnetron sputtering

Mechanical and tribological behavior of silicon nitride and silicon carbon nitride coatings for total joint replacements

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