“…To solve this problem, it is necessary to develop a novel find shadow mask technology within a taper angle above 80°. As candidate technologies, laser‐patterned invar mask, electroforming fine metal mask, photolithography‐based silicon nitride masks, and hybrid nanoimprint wafer mask were reviewed these days 2,3 . In addition to these methods, fine glass mask using laser‐induced deep etching has also been researched, but there is a limit to reducing the pitch size of mask pattern due to the etching process 4 …”