2020
DOI: 10.1109/ted.2019.2959883
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High-Performance TiN/Al2O3/ZnO/Al2O3/TiN Flexible RRAM Device With High Bending Condition

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Cited by 53 publications
(38 citation statements)
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“…In this review, we will present RRAM-related inorganic materials with oxides, solid electrolyte and two-dimensional (2D) materials. [9,20,75], NiO [8,12,76], TiO 2 [21,77,78], HfO 2 [60,79,80], ZnO [81][82][83], and ZrO 2 [22,84,85] are always playing main roles in materials application of RS medium. The first report of RS performance in binary metal oxides was proposed by Hickmott in 1962 [91], which demonstrated the RS characteristics of Al/Al 2 O 3 /Al device under the effect of an electric field.…”
Section: Thin Film Materials Of Rs Mediummentioning
confidence: 99%
“…In this review, we will present RRAM-related inorganic materials with oxides, solid electrolyte and two-dimensional (2D) materials. [9,20,75], NiO [8,12,76], TiO 2 [21,77,78], HfO 2 [60,79,80], ZnO [81][82][83], and ZrO 2 [22,84,85] are always playing main roles in materials application of RS medium. The first report of RS performance in binary metal oxides was proposed by Hickmott in 1962 [91], which demonstrated the RS characteristics of Al/Al 2 O 3 /Al device under the effect of an electric field.…”
Section: Thin Film Materials Of Rs Mediummentioning
confidence: 99%
“…The RS mechanism of the device, which includes the formation and rupture of the conductive filament for the device, is illustrated in figure 3. The CF forms into a conical shape, where the thicker part of the filament is on the cathode side while the thinner part is on the anode side [26]. Therefore, during the electroforming or SET process, the RS region is feasibly closer to the interface of ITO TE and the HfO 2 layer in the ITO/HfO 2 /ITO device, as shown in Fig.…”
Section: Resultsmentioning
confidence: 99%
“…The ITO/HfO 2 /ITO structure is thus a good candidate for a fully transparent resistive random-access memory (RRAM) device. Bipolar switching is commonly ascribed to a vacancy filament, which can be alternately ruptured or reformed via oxygen exchange with the electrode [26], [27]. The RS mechanism of the device, which includes the formation and rupture of the conductive filament for the device, is illustrated in figure 3.…”
Section: Resultsmentioning
confidence: 99%
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“…The mechanism of resistive random access memory (RRAM) is resistance switching through the conductive filament growth and rupture which is controlled by applied voltage [1][2][3][4][5]. The most common resistance switching materials are transition metal oxides, such as HfO x , TiO x , ZnO x , WO x , TaO x , NiO x , and AlO x [6][7][8][9][10][11][12][13][14]. However, RRAM with traditional resistance switching materials has some problems such as large reading current, low integration density, and big power consumption.…”
Section: Introductionmentioning
confidence: 99%