High-Performance Thermal Management Nanocomposites: Silver Functionalized Graphene Nanosheets and Multiwalled Carbon Nanotube

Zhou, Yongcun; Zhuang, Xiao; Wu, Feixiang; Liu, Feng

doi:10.3390/cryst8110398

Cited by 12 publications

(6 citation statements)

References 54 publications

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“…Copper (Cu) is one of the most important metals in modern technology because of its inherent continuity, elevated thermal conductivity, and affordability. Therefore, copper nanoparticles (CuNPs) and copper nanowires (CuNWs) are excellent candidates for orientation fillers in polymer matrix composite films with high thermal conductivity [6,7,8,9,10,11,12,13]. Unfortunately, elevated electrical conductivity and relative permittivity hamper the application of copper-based materials for electronic packaging, which requires electrical insulation.…”

Section: Introductionmentioning

confidence: 99%

Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires

Zhou

Niu

et al. 2018

Polymers

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Electronic devices are increasingly dense, underscoring the need for effective thermal management. A polyimide (PI) matrix nanocomposite film combining boron nitride (BN)-coated copper nanoparticles (CuNPs@BN) and nanowires (CuNWs@BN) was fabricated by a flexible and fast technique for enhanced thermal conductivity and the dielectric properties of nanocomposite films. The thermal conductivity of (CuNPs-CuNWs)@BN/PI composite comprising 10 wt % filler loading rose to 4.32 W/mK, indicating a nearly 24.1-fold increase relative to the value obtained for pure PI matrix. The relative permittivity and dielectric loss approximated 4.92 and 0.026 at 1 MHz, respectively. The results indicated that the surface modification of CuNPs and CuNWs by introducing a ceramic insulating layer BN effectively promoted the formation of thermal conductive networks of nanofillers in the PI matrix. This study enabled the identification of appropriate modifier fillers for polymer matrix nanocomposites to improve electronic applications.

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Section: Introductionmentioning

confidence: 99%

Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires

Zhou

Niu

et al. 2018

Polymers

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“…[124] For the particle-filled thermally conductive polymer material, the thermal conductivity is much lower than that of the theoretical prediction, this is mainly due to the poor interfacial compatibility and high interfacial thermal resistance between the matrix and fillers. [125][126][127][128] Therefore, a series of factors such as filler type, size, shape, loading, distribution, and the mutual effect between polymer and filler would all produce a strong impact on the ultimate 𝜆 value of the composites. [129][130][131] The type of thermally conductive filler will significantly affect the thermal conductivity of the composite.…”

Section: Critical Factors For the Thermal Conductivity Of Polymers Co...mentioning

confidence: 99%

A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

Wang

Weng

et al. 2023

Adv Funct Materials

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Recently, the need for miniaturization and high integration have steered a strong technical wave in developing (micro‐)electronic devices. However, excessive amounts of heat may be generated during operation/charging, severely affecting device performance and leading to life/property loss. Benefiting from their low density, easy processing and low manufacturing cost, thermally conductive polymer composites have become a research hotspot to mitigate the disadvantage of excessive heat, with potential applications in 5G communication, electronic packaging and energy transmission. By far, the reported thermal conductivity coefficient (λ) of thermally conductive polymer composite is far from expectation. Deeper understanding of heat transfer mechanism is desired for developing next generation thermally conductive composites. This review holistically scopes current advances in this field, while giving special attention to critical factors that affect thermal conductivity in polymer composites as well as the thermal conduction mechanisms on how to enhance the λ value. This review covers critical factors such as interfacial thermal resistance, chain structure of polymer, intrinsic λ value of different thermally conductive fillers, orientation/configuration of nanoparticles, 3D interconnected networks, processing technology, etc. The applications of thermally conductive polymer composites in electronic devices are summarized. The existing problems are also discussed, new challenges and opportunities are prospected.

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“…Zhou et al 83 used graphene and multiwall carbon nanotube (MWCNT) to formulate a hybrid polymer composite at 20% filler loading. The finding showed the increment of TC of up to 12.3 W/mK, which was believed to be due to the high intrinsic TC of graphene and MWCNT.…”

Section: Polymer Composites As New Die‐attach Materialsmentioning

confidence: 99%

Interface thermal resistance and thermal conductivity of polymer composites at different types, shapes, and sizes of fillers: A review

et al. 2021

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The growing demand toward miniaturization and power device packaging required new die‐attach materials with high thermal conductivity (TC). Multitudinous attention is being paid to enhance the TC of thermally conductive polymer composites as it is easy to fabricate and environmentally friendly and has low‐cost processability. However, after years of extensive research, it can be concluded that reinforcing different morphologies of fillers (types, sizes, and shapes) into polymer composite creates interfacial thermal resistance (ITR) that greatly constrains the TC value. Thus, this article presents an exhaustive review in minimizing the ITR effect by optimizing the types, sizes, and shapes of the fillers used. This literature also seeks to review the use of different morphologies of fillers in single and hybrid polymer composites. It was found that hybridizing two different fillers shows remarkable TC enhancement due to its synergistic effect and formation of three‐dimensional network/conduction path. The size and shape of fillers used play a vital role in improving the TC of the polymer composite compared with the type of filler used due to more contact area created, which significantly reduces the ITR. The results presented here may facilitate improvement in the development of future work for new die attach of the thermally conductive polymer composite.

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High-Performance Thermal Management Nanocomposites: Silver Functionalized Graphene Nanosheets and Multiwalled Carbon Nanotube

Cited by 12 publications

References 54 publications

Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires

Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires

A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

Interface thermal resistance and thermal conductivity of polymer composites at different types, shapes, and sizes of fillers: A review

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