High performance positive DUV photoresists AZ® DX 1100P, AZ® DX 1200P. AZ® DX 1300P, AZ® DX 2034P, AZ® DX 2058P for advanced lithographic applications

Spieß, W.; Kinoshita, Yoshiaki; Nozaki, Yuko; Pawlowski, Georg

doi:10.1016/s0167-9317(98)00078-1

Cited by 4 publications

References 2 publications

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Photolithography

Leuschner

Pawlowski²

2013

Materials Science and Technology

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The sections in this article are Introduction Exposure Tools Image Formation and Resolution Contact and Proximity Printing Optical Mask Aligner X‐Ray Stepper Projection Printing Near UV Projection Systems Deep UV Projection Systems Nonconventional UV Lithography Post‐Optical Lithography Photoresist Processing Quality Control and Resist Deposition Purity and Storage Stability Resist Coating Resist Exposure and Development Characteristic Curve and Standing Wave Effects Process Latitudes Dissolution Rate and Development Methods Pattern Inspection and Resist Profile Simulation Etching, Resist Stripping and Planarization Photoresists Principles of Photoresist Chemistry Negative‐Tone Resists Photocrossslinking Via Azides Free‐Radical‐Initiated Polymerization Acid‐Catalyzed Crosslinking Positive‐Tone Resists Dissolution Inhibition/Dissolution Promotion Acid‐Catalyzed Deblocking Polymer Degradation Solvents for Photoresists and Main Resist Suppliers Special Photoresist Techniques Nonconventional Diazo Resist Processes Resist Profile Modification and Image Reversal Bilayer Systems for Contrast Enhancement Suppression of Reflections and Standing Wave Effects Dyed Resists Antireflective Layers Silicon‐Containing Multilayer Resists Negative‐Tone Silicon Bilayer Resists Positive‐Tone Silicon Bilayer Resists Top Surface Imaging Gas Phase Silylation Systems Liquid Phase Silylation Systems Trends in Photolithography

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