High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding

Gim, MinHo; Kim, ChoongHoe; Na, SeokHo; Ryu, Dongsu; Park, KyungRok; Kim, Jin‐Young

doi:10.1109/ectc32862.2020.00166

“…In order to protect the image sensor from possible damage during LAB process, the set-up is equipped with optical longpass filter with cut-on wavelength of 1000 nm and a damage threshold of 12 kW/cm 2 (0.3 J/cm 2 ) for CW (Pulsed) mode; this blocks all visible wavelengths and most typical laser illumination at 980 nm used in LAB processes [8] - [9], [19].…”

Section: Ir Microscope Optical Designmentioning

confidence: 99%

“…To TCPMT-2022-353 this end, Laser-Assisted Bonding (LAB), which is known to be much faster than classical TCB and mass-reflow MR processes. Moreover, LAB cause negligible thermo-induced stress and warpage of the bonded surfaces, which is again a benefit compared to TCB and MR processes [8] - [9]. Yet another advantage is the fact that LAB can rely on solder surface tension-driven self-alignment [10], which can help to achieve better performance of photonic integration [9] - [11].…”

Section: Introductionmentioning

confidence: 99%

Machine Vision System Utilizing Black Silicon CMOS Camera for Through-Silicon Alignment

Власов

¹

,

Aydin

²

,

Uusitalo

³

et al. 2022

IEEE Trans. Compon., Packag. Manufact. Technol.

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Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, and silicon photonics. To this end, on-chip integration using silicon-photonics platform offers a wide range of possibilities addressing passive optics functionality, active optoelectronic devices, and compatibility with CMOS fabrication. On the other hand, the hybrid technology enabling volume manufacturing of such systemon-chip components it is still in an early development stage. Here, a new type of machine vision system enabling precision stacking and bonding processes of III-V components on silicon photonics chips is introduced. In particular, we focus on the ability to see through substrates with high resolution, which is crucial for the alignment of the markers used for assembly of integrated components on silicon wafer. The system is based on the use of a black silicon enhanced CMOS sensor with extended wavelength response beyond transparency cut off wavelength for silicon substrate. We study the use of the camera system as a microscope with bottom coaxial infrared illumination scheme and demonstrate the ability of through-silicon vision for one-and twolayered silicon photonic integrated circuit samples. The ability of observing objects with dimensions down to 2 µm is confirmed. This resolution is close to diffraction limit and corresponds to the dimensions of optical waveguide structures on the photonic integrated circuits surface. In addition, we demonstrate the implementation of a two-dimensional Fourier transform based autofocusing technique for through-silicon IR microscopy. These building blocks offer a solution for advanced photonic integration processes and other through-silicon vision related applications, which is instrumental for a large variety of assembly, lithography, and wafer bonding setups.

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“…Despite many important advances, photonic integration technology requires significant development to attain the yield, the throughput, and versatility required to engage with emerging applications. To this end, one of the most promising solutions to cointegrate complimentary photonic chips is laser-assisted bonding (LAB), owing to low thermal-induced stress and warpage to bonded surfaces [2].…”

Section: Introductionmentioning

confidence: 99%

Laser-Assisted Bonding Approach for Photonic Integration Processes

Vlasov,

Uusitalo,

Lepukhov

et al. 2024

IMAPSource Proceedings

0

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Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, and silicon photonics. To this end, on-chip integration using siliconphotonics platform offers a wide range of possibilities addressing passive optics functionality, active optoelectronic devices, and compatibility with CMOS fabrication. On the other hand, the hybrid technology enabling volume manufacturing of such system-on-chip components it is still in an early development stage. In this work, the original LAB setup with a coaxial bottom irradiation architecture was developed. The setup allows a rapid and energy-effective process with the ability to produce successful electrical bonds with negligible thermalinduced stress and warpage to bonded surfaces. The proposed machine-vision based temperature sensor is validated for photonic integration assembly processes.

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