High performance chip to substrate interconnects utilizing embedded structure

Abstract

Integrated circuit (IC) feature sizes reaching nanoscale range, it is important to bridge the gap between modules and chips with design rules similar to that of IC fabrication technologies. A proper transition calls for improved interconnect design and embedding of IC's to preserve signal integrity. This paper presents a high performance packaging approach for state-of-the-art high frequency IC's (HFIC's). Evaporation-, sputtering-and liftoff procedures were adopted to create smooth, fully planar Au-Cu-Au metallization on low dielectric constant (k) substrates utilizing a dual-mode transmission line in order to decrease microwave losses in carrier interconnects. A special attention was put to investigation of via hole formation.Index Terms-High frequency IC packaging, multichip modules (MCM), package substrate materials, substrate via formation, transmission line design.

Enhancement of Epoxy Resin/Copper Heterojunction by Introduction of Sulfur‐Containing Polymers

“…Oxidation on a copper surface formed a bumpy copper oxide layer which increases the bonding strength of the epoxy resin/copper heterojunction by means of an anchoring effect 5–7. In recent years, a smoother surface on the copper is required because of the skin effect related to the high frequency of metal wiring in electric devices 8. Epoxy resins cured with acid anhydride have also been used as transparent encapsulants for light‐emitting diodes (LED) 9.…”