Enhancement of Epoxy Resin/Copper Heterojunction by Introduction of Sulfur‐Containing Polymers

Honda, Hiroshi; Okada, Taketo; Nakamura, Yoshinobu; Kadota, Joji; Watase, Seiji; Hasegawa, Kiichi

doi:10.1002/mame.200500321

Cited by 10 publications

(3 citation statements)

References 20 publications

(15 reference statements)

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“…Furthermore, there are comparatively few studies in the literature on the use of sulphur in epoxy resins despite some evidence of improved adhesion 14 and thermal stability. 15 It is more common, however, that sulphur-containing mercaptan resins are used as hardeners 16,17 in epoxy resin systems where the rapid curing at low temperature and excellent fluid resistance makes them ideal sealants.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterisation of new sulphur-containing epoxy networks

Vogel

Dingemans

Varley

et al. 2014

High Performance Polymers

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The position of sulphur within a cured epoxy amine network and its impact upon the thermal, mechanical, chemical and physical properties has been investigated in this study. Sulphur-containing epoxy resins, diglycidyl thioether of bisphenol A (DGTEBA) and diglycidyl ether of dithio diphenyl (DGTED) have been synthesised, cured and characterised and then compared with the benchmark epoxy resin, diglycidyl ether of bisphenol A (DGEBA). DGTEBA has two sulphur atoms located terminally to the epoxide groups, whilst DGTED has a sulphur atom located centrally between two phenyl groups. Evaluation of the properties and cure mechanism using 4,4 0 -diamino diphenyl sulphone (4,4 0 -DDS) as the hardener showed that when the sulphur was terminally located, the glass transition temperature, cure conversion, thermal stability, yield strain and stress decrease substantially, whilst the rate of cure and methyl ethyl ketone (MEK) ingress was comparatively higher. Near-infrared spectroscopy revealed that a competing hydrogen abstraction reaction mechanism deactivated the epoxide ring to nucleophilic attack to produce a heterogeneous network and poorer properties. In contrast, the properties and network structure of the DGTED-cured network, which had sulphur placed centrally between the diphenyl groups were similar to DGEBA except that MEK fluid ingress was reduced. The DGTEBA epoxy was also cured with other amines of varying reactivity to reveal that the hydrogen abstraction mechanism was dependent upon the reactivity of the hardener. Less reactive hardeners were dominated by the hydrogen abstraction mechanism, whilst the more reactive amines displayed a step-growth mechanism more typically associated with epoxy amine cure.

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Section: Introductionmentioning

confidence: 99%

Synthesis and characterisation of new sulphur-containing epoxy networks

Vogel

Dingemans

Varley

et al. 2014

High Performance Polymers

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“…In recent years, there is an increasing demand for high refractive index polymers with high transparency and low birefringence for advanced integrated optical applications. − Many conventional sulfur-containing polymers characterized by high optical transparency, a high dielectric constant, good adhesion to the substrates, and a high refractive index have been reported. On the other hand, the thermal stability of polymers is becoming an important consideration in the design of advanced optical devices due to the severe heat environment present during fabrication processes .…”

Section: Introductionmentioning

confidence: 99%

High Refractive Index Polyimides Derived from 2,7-Bis(4-aminophenylenesulfanyl)thianthrene and Aromatic Dianhydrides

et al. 2007

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High refractive aromatic polyimides (PIs) containing a thianthrene-2,7-disulfanyl moiety in their main chain have been developed. The PIs were prepared from a newly developed aromatic diamine 2,7-bis(4-aminophenylenesulfanyl)thianthrene (APTT) and several aromatic dianhydrides by a two-step polycondensation procedure. The relationships between the structures and the thermal, mechanical, and optical properties of the flexible, tough, transparent, and amorphous PI films were established. Introduction of the thianthrene-2,7-disulfanyl group endowed the PIs with good combined properties, including high thermal stability with 10% weight loss temperatures (T 10%) higher than 500 °C in nitrogen and the glass transition temperatures (T gs) higher than 200 °C, good transparency with transmittances higher than 80% at 500 nm, and refractive indices higher than 1.73 at 632.8 nm. Because of higher sulfur content, the refractive indices of the PIs we synthesized are higher than those of PIs derived from the other sulfur-containing diamines such as 4,4‘-(p-phenylenedisulfanyl)dianiline (2SPDA) and 4,4‘-thiobis[(p-phenylenesulfanyl)aniline] (3SDA). The PI derived from APTT and 4,4‘-[p-thiobis(phenylenesulfanyl)]diphthalic anhydride (3SDEA) has the highest sulfur content (23.2%) in its repeating units, and hence, it exhibits the highest refractive index, i.e., 1.7600.

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“…Lavrenyuk and colleagues developed self-extinguishing copper(II)-coordinated epoxy-amine composites for pouring polymer floors, demonstrating progress in creating materials with improved properties [50]. Honda et al demonstrated a strengthening of the epoxy-copper heterojunction by incorporating sulfur-containing polymers, suggesting new approaches to improving material interfaces [51].…”

Section: Discussionmentioning

confidence: 99%

The Influence of Copper Oxide Particle Size on the Properties of Epoxy Resin

Bazan,

Gajda,

Nosal

et al. 2024

Applied Sciences

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This study examines the relationship between the size of copper particles and the properties of epoxy resin. Epoxy resin is a type of thermosetting resin commonly used as a matrix in polymer matrix composite materials reinforced with glass or carbon fibers. As part of this study, three microscale and two nanoscale composite samples modified with copper oxide particles of varying sizes were produced. This study included mechanical property tests such as static tensile tests, static bending tests, and impact tests. The results of the strength tests were compared to modeling results. Additionally, an accelerated thermal aging process was conducted to determine the impact of external conditions on the behavior of the produced composites. This study concluded with an analysis of thermal conductivity. The test results revealed that the size of the copper particles significantly impacted the tested properties. The composites with copper oxide particles on the nanoscale demonstrated the best results. These composites have promising applications in the automotive and aviation industries due to their strength, resistance to external factors, and increased thermal conductivity, suggesting their potential for producing materials that effectively dissipate heat.

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Enhancement of Epoxy Resin/Copper Heterojunction by Introduction of Sulfur‐Containing Polymers

Cited by 10 publications

References 20 publications

Synthesis and characterisation of new sulphur-containing epoxy networks

Synthesis and characterisation of new sulphur-containing epoxy networks

High Refractive Index Polyimides Derived from 2,7-Bis(4-aminophenylenesulfanyl)thianthrene and Aromatic Dianhydrides

The Influence of Copper Oxide Particle Size on the Properties of Epoxy Resin

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