High-performance ceramic/epoxy composite adhesives enabled by rational ceramic bandgaps

Abstract

High over-all properties, including low dielectric loss, high breakdown strength, high mechanical shock strength, high thermal conductivity and high weight stability, are very difficult to simultaneously achieve in electrical-insulation applicable cured potting-adhesive materials. to deal with this challenge, in this work, we have designed and fabricated a series of epoxy based composite potting-adhesives filled with low-cost and high-performance inorganic micro-particles including alpha-silica, alphaalumina and alpha-Sic. combination employment of high-molecular-weight and low-molecular-weight epoxy resins as matrices has been made. Heat-induced curing or crosslink of resin matrices has been carried out. Large band gap of silica filler has endowed the cured composite with high breakdown strength and ageing breakdown strength, and meanwhile relatively high deformation trait of silica has led to high shock strength of cured composite. Silica filler has been found to be superior to other two fillers, namely, optimal over-all properties such as dielectric, breakdown, mechanical and thermal features have been obtained in silica filled cured composite. High breakdown strength of ~48 MV m −1 and shock strength of ~9950 J m −2 have been achieved in silica loaded composite. this work might open up the way for large-scale fabrication of promising epoxy-based hybrid potting-adhesives.Recently, potting adhesive materials with promising electrical, mechanical and thermal properties have triggered general attention and research interest in the field of fabricating aerospace applicable special power supplies 1 . Inorganic particles filled polymer based hybrid potting adhesives are consisting of polymer matrix, curing-agent, curing boosting agent, plasticizer, thermally conductive filler, reactive diluent and demoulding agent 2 . Plenty of epoxy resins in different trademarks have been employed as matrix materials of hybrid potting adhesives, thanks to their high Young's modulus, strong bonding force toward massive substrates, high solvent resistance and low production cost. Mixing different epoxy resins as matrices has been found to be highly helpful to achieving desirable high fluidity and high mechanical strength in composite potting adhesives, at the same time 3 . Furthermore, lots of acid-anhydride derived curing-agents such as methyl tetrahydrophthalic anhydride have been adopted in hybrid potting adhesives, attributed to rather wide temperature-applying range and favorable high electric insulation trait of cured epoxy based adhesives gained via those curing-agents 4 . By using those acid-anhydride derived curing-agents, potting adhesives have achieved several desired features such as easy perfusion process, low curing volume-shrinkage and high curing mechanical property. Besides, amine derived curing-agents have been found to result in property failure of cured adhesives at high temperature, but no performance failure was found at low temperature 5 .Although huge success has been obtained in acid-anhydride derived curing...

Systematic coarse-graining of epoxy resins with machine learning-informed energy renormalization

“…Chemistry-specific molecular models are critically needed to bridge the gap in scales between molecular dynamics (MD) simulations and experiments, while predicting accurately the highly tunable macroscopic properties of epoxy resins and their composites 1-3 . This remains a challenging problem to tackle due to the chemical complexity [4][5][6] of epoxy resins, the high number of properties that must be targeted for realistic predictions, and their strong dependence on the degree of crosslinking (DC) [7][8][9][10][11][12] . This up-scaling problem requires multi-dimensional functional calibration, taking inputs from high-fidelity simulations such as all-atomistic simulations.…”

Experimental EDX analysis of different periodontal splinting systems

“…9950 J m -2 . This study may open the door towards the large-scale manufacture of high-performance epoxy composite potting-adhesives ( 23 ).…”

Analisis Material Efoxy EF150K Terhadap Temperatur dan Kelembaman Tinggi Pada Komponen Charger Mobil Listrik

“…Hu (2020) membahas percobaan pencampuran material Resin epoksi bisphenol-A (JY462) dicampur dengan alfa-silika, alfa alumina, dan alfa-SiC. Hasil penelitian ditemukan bahwa Silica filler lebih unggul dari dua fller lainnya, yaitu, sifat keseluruhan yang optimal seperti fitur dielektrik, kerusakan, mekanik dan termal telah diperoleh dalam komposit yang dicampur dengan silika (Hu, 2020). Pada penelitian ini membahas tentang bahan isolator dari material Epoxy EF150K untuk Disc Ceramic Capacitor (DCC) yang terdapat pada charger mobil listrik, tujuan penelitian yaitu untuk menguji performance dari material isolator, dengan melakukan pengujian Pressure Cycle Temperature (PCT) dan humiditas (Bo, 2019).…”