2006 International Electron Devices Meeting 2006
DOI: 10.1109/iedm.2006.346879
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High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography

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Cited by 77 publications
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“…This material is utilized in the 12SOI process for compressively straining pFET channels, therefore, increasing the hole mobility. 14,15 The optical mode and the cross section of the photodetector are shown in Fig. 1(a).…”
mentioning
confidence: 99%
“…This material is utilized in the 12SOI process for compressively straining pFET channels, therefore, increasing the hole mobility. 14,15 The optical mode and the cross section of the photodetector are shown in Fig. 1(a).…”
mentioning
confidence: 99%