High-modulus rotary jet spun co-polyimide nanofibers and their composites

Rogalski, James J.; Zhang, Han; Bastiaansen, Cees W. M.; Peijs, Ton

doi:10.1080/20550324.2019.1687174

Cited by 9 publications

(5 citation statements)

References 35 publications

(50 reference statements)

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“…In recent years, the rapid development of electrospun PI nano-fibrous membranes (NFMs) provides an instructive and valuable idea for developing solventless PI adhesives for high-temperature applications [15][16][17][18][19]. By analyzing the microscopic and macroscopic structural characteristics of PI NFMs, we can find that such materials possess high specific surface areas, high flexibility, highly entangled structure, and solvent-free characteristics, which are all required for high-performance PI adhesives [20][21][22][23].…”

Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

Shen

Jia

et al. 2021

Nanomaterials

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High-temperature-resistant polymeric adhesives with high servicing temperatures and high adhesion strengths are highly desired in aerospace, aviation, microelectronic and other high-tech areas. The currently used high-temperature resistant polymeric adhesives, such as polyamic acid (PAA), are usually made from the high contents of solvents in the composition, which might cause adhesion failure due to the undesirable voids caused by the evaporation of the solvents. In the current work, electrospun preimidized polyimide (PI) nano-fibrous membranes (NFMs) were proposed to be used as solvent-free or solvent-less adhesives for stainless steel adhesion. In order to enhance the adhesion reliability of the PI NFMs, thermally crosslinkable phenylethynyl end-cappers were incorporated into the PIs derived from 3,3’,4,4’-oxydiphthalic anhydride (ODPA) and 3,3-bis[4-(4-aminophenoxy)phenyl]phthalide (BAPPT). The derived phenylethynyl-terminated PETI-10K and PETI-20K with the controlled molecular weights of 10,000 g mol−1 and 20,000 g mol−1, respectively, showed good solubility in polar aprotic solvents, such as N-methyl-2-pyrrolidinone (NMP) and N,N-dimethylacetamide (DMAc). The PI NFMs were successfully fabricated by electrospinning with the PETI/DMAc solutions. The ultrafine PETI NFMs showed the average fiber diameters (dav) of 627 nm for PETI-10K 695 nm for PETI-20K, respectively. The PETI NFMs showed good thermal resistance, which is reflected in the glass transition temperatures (Tgs) above 270 °C. The PETI NFMs exhibited excellent thermoplasticity at elevated temperatures. The stainless steel adherends were successfully adhered using the PETI NFMs as the adhesives. The PI NFMs provided good adhesion to the stainless steels with the single lap shear strengths (LSS) higher than 20.0 MPa either at room temperature (25 °C) or at an elevated temperature (200 °C).

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Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

Shen

Jia

et al. 2021

Nanomaterials

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“…The characteristic absorption peaks of PIFs were located at 1782, 1720, 1375, and 716 cm –1 , which belonged to CO, C–N, and imide ring (Figure c). In addition, PIF-300 exhibited the absorption peaks at 3451, 2918, and 2850 cm –1 , which were related to the presence of O–H (from PA) and CH 2 (from MDA) in the chain backbone of PEAS P1BMN3 -2. , The 13 C NMR spectrum of PIF P1BMN3 -2 is displayed in Figure b. The chemical shifts located at 192, 165, 110–150, 82, 42, and 32 ppm were attributed to the CO between benzene rings, CO on imide ring, aromatic rings, C–OH, CH 2 , and C–H, respectively .…”

Section: Results and Discussionmentioning

confidence: 99%

Fabrication of Rigid Polyimide Foams by Constructing Dual Crosslinking Network Structures

Luo

Shen

et al. 2023

Ind. Eng. Chem. Res.

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Herein, lightweight rigid polyimide foams (PIFs) with excellent mechanical and thermal properties were fabricated by constructing dual crosslinking structures combined with the thermal foaming of polyester ammonium salt (PEAS) precursor powders. The dual crosslinking network relied on the self-crosslinking of pararosaniline base (PA) and active crosslinking derived from the breakage of CC bonds in 5-norbornene-2, 3-dicarboxylic anhydride (NA) under heating. The results showed that melt viscosity and micro-foaming behavior of PEASs and the cell morphology of PIFs could be regulated by varying the molar ratio of PA/NA and the number of repeating units amid crosslinking points. The compressive strength of PIFP1BMN3-5 (density: 165.5 kg·m–3) with dual crosslinking structures at 10% strain reached 1.36 MPa at room temperature and 0.75 MPa at 200 °C. The PIFs exhibited outstanding thermal properties with the initial thermal degradation temperature falling in a temperature range of 458.2–503.0 °C and the glass-transition temperatures exceeding 310 °C. In addition, PIFs exhibited excellent thermal insulation properties since the thermal conductivity of PIFs was between 0.048 and 0.065 W·m–1 K–1, and the temperature increase of the top surface of the cubic sample block (height: 15 mm) was approximately 20 °C when they were placed on a preheated hot stage at 200 °C for 30 min. Thus, mechanically strong rigid PIFs with dual crosslinking structures were successfully prepared, which show promising applications as lightweight, high-temperature-resistant structural materials in high-end engineering fields.

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“…The size effect and surface effect brought about by fiber diameter refinement endow many unique properties [ 91 , 92 ]. The preparation methods of PI nanofibers include electrostatic spinning [ 93 ], centrifugal jet spinning [ 94 , 95 ], sonochemistry [ 96 ], solution blow spinning, and melt spinning [ 97 , 98 ]. Among them, electrostatic spinning is the most commonly used method because of its simple manufacturing equipment and high process controllability [ 99 ].…”

Section: Pi Basic Informationmentioning

confidence: 99%

Research Progress and Application of Polyimide-Based Nanocomposites

Liu

Wang

et al. 2023

Nanomaterials

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Polyimide (PI) is one of the most dominant engineering plastics with excellent thermal, mechanical, chemical stability and dielectric performance. Further improving the versatility of PIs is of great significance, broadening their application prospects. Thus, integrating functional nanofillers can finely tune the individual characteristic to a certain extent as required by the function. Integrating the two complementary benefits, PI-based composites strongly expand applications, such as aerospace, microelectronic devices, separation membranes, catalysis, and sensors. Here, from the perspective of system science, the recent studies of PI-based composites for molecular design, manufacturing process, combination methods, and the relevant applications are reviewed, more relevantly on the mechanism underlying the phenomena. Additionally, a systematic summary of the current challenges and further directions for PI nanocomposites is presented. Hence, the review will pave the way for future studies.

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High-modulus rotary jet spun co-polyimide nanofibers and their composites

Cited by 9 publications

References 35 publications

Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

Fabrication of Rigid Polyimide Foams by Constructing Dual Crosslinking Network Structures

Research Progress and Application of Polyimide-Based Nanocomposites

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