High-mobility poly-Si TFTs fabricated on flexible stainless-steel substrates

Serikawa, Tadashi; Omata, Fujio

doi:10.1109/55.798048

Cited by 45 publications

(25 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…All polysilicon TFT devices and circuits in this work [4][5][6][7] were fabricated on 150 mm flexible stainless style type 304 substrates that were 125 lm thick. The metal foil substrates were polished to a mirror finish with an average surface roughness of only 3 nm.…”

Section: Polysilicon Thin Film Transistormentioning

confidence: 99%

Polysilicon TFT circuits on flexible stainless steel foils

Troccoli

Roudbari

Chuang

et al. 2006

Solid-State Electronics

View full text Add to dashboard Cite

Section: Polysilicon Thin Film Transistormentioning

confidence: 99%

Polysilicon TFT circuits on flexible stainless steel foils

Troccoli

Roudbari

Chuang

et al. 2006

Solid-State Electronics

View full text Add to dashboard Cite

“…[36][37][38] The best results to date correspond to n-channel mobility of up to 267 cm 2 /V s and p-channel mobility of 88 cm 2 /V s with a highest reported process temperature of 400°C. [36][37][38] The best results to date correspond to n-channel mobility of up to 267 cm 2 /V s and p-channel mobility of 88 cm 2 /V s with a highest reported process temperature of 400°C.…”

Section: Low-temperature Poly-si Thin-film Transistors and Circuits Omentioning

confidence: 99%

Low-Temperature Polycrystalline Silicon Thin-Film Transistors and Circuits on Flexible Substrates

Wilt¹,

Kane²,

Limanov³

et al. 2006

MRS Bull.

View full text Add to dashboard Cite

Low-defect-density polycrystalline Si on flexible substrates can be instrumental in realizing the full potential of macroelectronics. Direct deposition or solid-phase crystallization techniques are often incompatible with polymers and produce materials with high defect densities. Excimer-laser annealing is capable of producing films of reasonable quality directly on polymer and metallic substrates. Sequential lateral solidification (SLS) is an advanced pulsed-laser-crystallization technique capable of producing Si films on polymers with lower defect density than can be obtained via excimer-laser annealing. Circuits built directly on polymers using these SLS films show the highest performance reported to date. For more information, see http://www.mrs.org/bulletin_ads For more information, see http://www.mrs.org/bulletin_ads

show abstract

“…Several research groups have integrated TFT arrays on metal foil as display backplane [2,4,[5][6][7]. Serikawa et al have focused on the integration of poly Si TFT on stainless steel substrate [6], and Xie et al reported EL deposition on metal foil as test cell [7].…”

Section: Impactmentioning

confidence: 99%

64.1: 5.6-inch Flexible Full Color Top Emission AMOLED Display on Stainless Steel Foil

Jin

Jeong

Shin

et al. 2006

SID Symposium Digest

View full text Add to dashboard Cite

The world first flexible full color 5.6‐inch active matrix organic light emitting diode (AMOLED) display with top emission mode on stainless steel foil is demonstrated. The active matrix back planes were fabricated using low temperature poly‐Si (LTPS). The p‐channel poly‐Si TFTs on the stainless steel foil exhibited the field‐effect mobility of 71.2 cm2/Vs, threshold voltage of −2.7 V, off current of 6.7× 1013 A/um, and subthreshold slope of 0.63 V/dec. These TFT performances made it possible to integrate scan driver circuit on the panel. A low‐cost planarization techniqe of stainless steel foil was developed to replace the expensive chemical mechanical planarization (CMP) method, which was the most critical barrier against mass production. The full color flexible AMOLED display on the stainless steel foil will be promising for mobile applications because of its thin, light, rugged, and design‐free properties.

show abstract

High-mobility poly-Si TFTs fabricated on flexible stainless-steel substrates

Cited by 45 publications

References 7 publications

Polysilicon TFT circuits on flexible stainless steel foils

Polysilicon TFT circuits on flexible stainless steel foils

Low-Temperature Polycrystalline Silicon Thin-Film Transistors and Circuits on Flexible Substrates

64.1: 5.6-inch Flexible Full Color Top Emission AMOLED Display on Stainless Steel Foil

Contact Info

Product

Resources

About