ever-increasing demand for higher data transfer rates in wired and wireless communication links. The exponential growth in data rates has pushed the carrier frequencies toward the higher spectral region, the terahertz (THz) band. The availability of ultrahigh bandwidths in the THz region (0.1-10 THz) allows achievement of terabits per second connectivity, [1] making it ideal for sixth-generation (6G) communication. However, with the emergence of 6G networks, the development of efficient on-chip communication with low loss and active control is crucial to handle and process the massive volume of data transmitted using THz carrier frequencies. The existing solutions for high-speed on-chip interconnects, including copper-based electrical interconnects (EIs), [2] suffer from limited bandwidth, and optical interconnects (OIs) [3] possess integration complexity and electronic-to-optical (EO/OE) conversion losses. To circumvent the existing performance gaps (in terms of bandwidths, energy efficiency, and system simplicity) of on-chip interconnects, THz interconnects [4,5] offer a potential route by leveraging the advantages of both the electronic and photonic worlds. However, scaling carrier frequencies up to sub-THz and beyond requires further innovation toward on-chip photonic solutions to support higher radio-frequency (RF) electronics Rapid scaling of semiconductor devices has led to an increase in the number of processor cores and integrated functionalities onto a single chip to support the growing demands of high-speed and large-volume consumer electronics. To meet this burgeoning demand, an improved interconnect capacity in terms of bandwidth density and active tunability is required for enhanced throughput and energy efficiency. Low-loss terahertz silicon interconnects with larger bandwidth offer a solution for the existing inter-/intrachip bandwidth density and energy-efficiency bottleneck. Here, a low-loss terahertz topological interconnect-cavity system is presented that can actively route signals through sharp bends, by critically coupling to a topological cavity with an ultrahigh-quality (Q) factor of 0.2 × 10 6 . The topologically protected large Q factor cavity enables energy-efficient optical control showing 60 dB modulation. Dynamic control is further demonstrated of the critical coupling between the topological interconnect-cavity for on-chip active tailoring of the cavity resonance linewidth, frequency, and modulation through complete suppression of the back reflection. The silicon topological cavity is complementary metal-oxide-semiconductor (CMOS)-compatible and highly desirable for hybrid electronic-photonic technologies for sixth (6G) generation terahertz communication devices. Ultrahigh-Q cavity also paves the path for designing ultrasensitive topological sensors, terahertz topological integrated circuits, and nonlinear topological photonic devices.The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/adma.202202370.