High-JcYBa2Cu3O7-xfilms on metal tapes by the metalorganic deposition method using trifluoroacetates

Araki, Takao; Yuasa, Toyotaka; Kurosaki, Haruhiko; Yamada, Yutaka; Hirabayashi, I.; Kato, Takumi; Hirayama, Tsukasa; Iijima, Y.; Saito, Takashi

doi:10.1088/0953-2048/15/1/101

Cited by 40 publications

(27 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The buffer layer system and the ReBa 2 Cu 3 O 7−δ -film are deposited with non-vacuum techniques [22], before the tape is covered with a cap layer of Re 1−x Ca x Ba 2 Cu 3 O 7−δ , annealed and cut. According to Fig.…”

Section: Fig 3 Calculated Critical Current Densities Of Variousmentioning

confidence: 99%

Possible solution of the grain-boundary problem for applications of high-Tc superconductors

Hammerl

Herrnberger

Schmehl

et al. 2002

Applied Physics Letters

View full text Add to dashboard Cite

It is shown that the critical current density of high-Tc wires can be greatly enhanced by using a threefold approach, which consists of grain alignment, doping, and optimization of the grain architecture. According to model calculations, current densities of 4 · 10 6 A/cm 2 can be achieved for an average grain alignment of 10• at 77 K. Based on this approach, a road to competitive high-Tc cables is proposed.Vital for large scale applications of high-T c superconductors [1,2] is the solution of the grain boundary problem, which manifests itself by the exponential decrease of the grain boundary critical current density J c of the high-T c cuprates as a function of the grain boundary angle [3,4].We propose to solve this problem using a threefold approach: through 1) grain alignment [3], 2) grain boundary doping [5], and 3) optimization of the microstructure to maximize the effective grain boundary area [6]. In contrast to the powder-in-tube technology where large grain boundary areas and grain alignment are used to enhance J c [7-9], today's coated conductor technologies [10][11][12] focus on grain alignment only. As we have shown, however, simple ways exist to also preferentially dope the grain boundaries [5] and engineer large effective grain boundary areas [13,14] to further enhance the performance of coated conductors.As pointed out in 1987, large effective grain boundary areas can be realized by engineering the microstructure of the superconductor to obtain grains with big aspect ratios, for example by stacking in a brickwall-type manner platelet-like grains on top of each other [6,7]. The enhancement of the critical currents hereby gained is responsible for the large J c of the Bi-based high-T c superconductors fabricated with the powder-in-tube technology [6-9]. Recently we found ways to use large effective grain boundary areas to enhance J c of coated conductors that consist of two-or three dimensional grain boundary networks, as illustrated in Fig. 1. Although it is clear that each one of the three techniques described substantially enhances J c , the increase that can be gained by utilizing all three, for example as shown by Fig. 2, is unknown.Therefore we have calculated the performance, which can be achieved by combining grain orientation, doping, and large effective grain boundary areas. Based on these calculations, optimized sets of parameters for the fabrication of coated conductors are derived. The calculation of current percolation through disordered networks of weak links, some of which may be Josephson junctions, is a complex problem [6]; and several algorithms have been developed for its solution (see, e. g. Ref. 6,(15)(16)(17)(18)(19). As the fast algorithms are limited to two-dimensional networks, for the present work a new one had to be devised. Like in several of the existing algorithms, to achieve the required speed, phase effects and self fields were neglected. FIG. 2.Simplified sketch of a tape, fabricated by the rolling assisted biaxially textured substrate (RABiTS) technology, with a m...

show abstract

Section: Fig 3 Calculated Critical Current Densities Of Variousmentioning

confidence: 99%

Possible solution of the grain-boundary problem for applications of high-Tc superconductors

Hammerl

Herrnberger

Schmehl

et al. 2002

Applied Physics Letters

View full text Add to dashboard Cite

show abstract

“…The film deposited using the TMAP-MOD process consequently does not generate fluorine-containing compounds, including BaF 2 and HF, and results in a much denser microstructure than films prepared by the TFA-MOD process [10][11][12][13]. The highest current densities of the film by the TMAP process exceed 1.6 × 10 6 A/cm 2 [14].…”

Section: Introductionmentioning

confidence: 99%

Multi-coated YBa₂Cu₃O_7-xFilms Fabricated by a Fluorine-Free Sol-Gel Process

Cho¹,

Jang²,

Hyun³

2011

Journal of Magnetics

View full text Add to dashboard Cite

YBa 2 C 3 O 7-x films were fabricated on a SrTiO 3 (100) substrate using a trimethylaceate propionic acid (TMAP)-based MOD process by controlling the precursor solution viscosity, firing temperature, and by using various coatings. The viscosity of the precursor solution was controlled by the addition of Xylenes. The films were heat treated with different temperatures from 750 to 800 o C. c-axis oriented films were obtained. After adding 9 ml of Xylene into the precursor solution, the T c of the YBCO film, which was coated 2 times and heat treated at 800 o C, was 86 K and the measured J c was above 2.5 MA/cm 2 at 77 K in a zero-field.

show abstract

“…The fluorinated routes using trifluoroacetates (TFA) as precursors have attracted much interest due to its high reproducibility in fabrication of high-quality YBCO films [1,2]. Today, process optimization has made the superconducting coated conductors derived from solution routes almost be commercialized [3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

“…The fluorine-free sol-gel process is of great potential in the commercialization the of YBCO coated conductors due to its advantages, which includes: (1) no HF formed during the process, which is corrosive to the buffer layer or the metallic substrate; (2) much denser microstructure compared to TFA films; (3) no extra phases (such as BaF 2 in TFA approach), in addition to YBCO. Using the fluorine-free route, high-performance YBCO films, however, cannot be easily obtained as the fluorinated route.…”

Section: Introductionmentioning

confidence: 99%

Fluorine-free sol–gel preparation of YBa2Cu3O7−x superconducting films by a direct annealing process

Chen¹,

Yan²,

Zhao³

et al. 2010

Journal of Alloys and Compounds

View full text Add to dashboard Cite

High-J_cYBa₂Cu₃O_7-xfilms on metal tapes by the metalorganic deposition method using trifluoroacetates

Cited by 40 publications

References 22 publications

Possible solution of the grain-boundary problem for applications of high-Tc superconductors

Possible solution of the grain-boundary problem for applications of high-Tc superconductors

Multi-coated YBa₂Cu₃O_7-xFilms Fabricated by a Fluorine-Free Sol-Gel Process

Fluorine-free sol–gel preparation of YBa2Cu3O7−x superconducting films by a direct annealing process

Contact Info

Product

Resources

About

High-JcYBa2Cu3O7-xfilms on metal tapes by the metalorganic deposition method using trifluoroacetates

Cited by 40 publications

References 22 publications

Possible solution of the grain-boundary problem for applications of high-Tc superconductors

Possible solution of the grain-boundary problem for applications of high-Tc superconductors

Multi-coated YBa2Cu3O7-xFilms Fabricated by a Fluorine-Free Sol-Gel Process

Fluorine-free sol–gel preparation of YBa2Cu3O7−x superconducting films by a direct annealing process

Contact Info

Product

Resources

About

High-J_cYBa₂Cu₃O_7-xfilms on metal tapes by the metalorganic deposition method using trifluoroacetates

Multi-coated YBa₂Cu₃O_7-xFilms Fabricated by a Fluorine-Free Sol-Gel Process