High-Gain Millimeter-Wave Antenna-in-Display Using Non-Optical Space for 5G Smartphones

Oh, Jeongtaek; Kim, Byeongjin; Yoon, Sang-Rock; Kim, Kiseo; Sung, Eunjin; Oh, Jungsuek

doi:10.1109/tap.2022.3228912

Cited by 6 publications

(1 citation statement)

References 44 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Prior research about antenna design targeted at millimeter wave/sub-THz applications focused on antenna-in-packaging and antenna-on-packaging (AoP), where the integration with radio frequency integrated circuits (RFIC) was a critical consideration [7]- [11]. Although substrate-integrated waveguide (SIW)-based strategies can achieve a wide bandwidth, they incur high manufacturing costs and consume extensive area owing to the multiple ground vias required for guiding radio waves [12].…”

Section: Introductionmentioning

confidence: 99%

140-GHz Affordable Miniaturized Array Antenna-on-Package for Sub-THz Transceiver

Oh,

2023

IEEE Access

Self Cite

View full text Add to dashboard Cite

In this paper, an affordable and miniaturized 140 GHz transmit/receive (TRX) array antennaon-package (AoP) is proposed through the conventional printed circuit board process employing a single substrate. The proposed design approach involved an in-depth analysis of the potential performance degradation of a D-band antenna operating within a coarse process and a practical design guide for the configuration of matching network packaging with robust wedge bonding. An asymmetric matching network design technique for 1×4 array antenna packaging considered the 1-bit digital beamforming capabilities of radio frequency integrated circuits (RFIC). In its unprecedented demonstration, an AoP with 1×2 transmitting and 1×4 receiving antennas was packaged with an RFIC. The measurements arrayed maximum gains of the transmit and receive antennas were 9.8 and 11.8 dBi, respectively. In addition, gain bandwidths of 12.6% and 20.4% were achieved for the transmit and receive antennas, respectively. This study marked the first instance of fabricating a TRX AoP using a single RF metal layer via a width/gap process condition of 100/80 µm in the D-band.INDEX TERMS Antenna-on-package (AoP), affordable, array, printed circuit board (PCB), single-layer, sixth generation (6G), wedge bonding, wide-band.

show abstract

Section: Introductionmentioning

confidence: 99%