2012
DOI: 10.1063/1.4742325
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High-frequency performance of scaled carbon nanotube array field-effect transistors

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Cited by 102 publications
(97 citation statements)
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“…As shown in Fig. 4d, the extrinsic cutoff frequency f T and maximum oscillation frequency f MAX achieved are 5.13 and 11.33 GHz, respectively, which are comparable to the best performance of SWNT array-based RF transistors 28 . The intrinsic f T and f MAX of our RF transistor are 6.94 and 14.01 GHz, respectively, after the de-embedding process.…”
Section: Resultssupporting
confidence: 49%
See 1 more Smart Citation
“…As shown in Fig. 4d, the extrinsic cutoff frequency f T and maximum oscillation frequency f MAX achieved are 5.13 and 11.33 GHz, respectively, which are comparable to the best performance of SWNT array-based RF transistors 28 . The intrinsic f T and f MAX of our RF transistor are 6.94 and 14.01 GHz, respectively, after the de-embedding process.…”
Section: Resultssupporting
confidence: 49%
“…Experimental and theoretical works have demonstrated that the densealigned SWNT arrays are important and desirable for the applications of nanotube-based electronics, such as ICs and radio frequency (RF) electronics 27,28 . To evaluate the electrical performance of such ultra-high-density-aligned SWNT arrays, top-gated field effect transistors (FET) based on our as-grown SWNT arrays were fabricated directly on the growth substrate, and the electrical transport measurements were carried out in both d.c. and a.c. domains.…”
Section: Resultsmentioning
confidence: 99%
“…T he extraordinary electrical properties [1][2][3] of semiconducting single-walled carbon nanotubes (s-SWNTs) make them uniquely attractive for use in logic transistors/circuits [4][5][6][7][8][9][10] , radiofrequency (RF) transistors [11][12][13][14][15][16] , optoelectronic devices [17][18][19] and sensors [20][21][22] . The required horizontally aligned array configurations in SWNTs are possible through chemical vapour deposition (CVD)-based growth on quartz substrates 23,24 .…”
mentioning
confidence: 99%
“…The important feature of this setup compared with conventional planar dielectrophoresis is that all the microelectrodes patterned on top of a thin 10-nm-thick thermal silicon oxide are wired together, while the underlying grounded silicon substrate serves as the counter electrode. Metal electrodes are further protected with a thin, c.a.B8 nm, layer of Al 2 O 3 deposited by atomic layer deposition to avoid potential material issues such as electromigration associated with heat dissipation during dielectrophoresis 25 . A few drops of dialysed SDS-nanotube suspension are applied onto the chip as the nanotube reservoir.…”
Section: Resultsmentioning
confidence: 99%