In this work, we present a novel method based on a plate wave sensor for the in situ monitoring of the thickness of quartz membranes during wet etching. Similarly to oscillators and resonators, some acoustic devices require the thickness of quartz membranes to be determined precisely. Precise control of the thickness of quartz membranes during wet etching is important, because the thickness strongly influences post processing and frequency control. Furthermore, the proposed plate wave sensor, allows the thickness of quartz membranes from a few µm to hundreds of µm to be monitored in situ, which depends on the periodicity of an interdigital transducer (IDT). In summary, the proposed method for measuring the thickness of quartz membranes in real time has a high accuracy, is simple to set up and can be mass-produced. Also described herein are the principles of the method used, the detailed process flow, the measurement set up and the simulation and experimental results. The theoretical and measured values differ by an error of less than 1 µm, implying a close correspondence.