High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction

Chemical force microscopy for hot-embossing lithography release layer characterization

“…stamp, we have observed several hundred embossing cycles with no substantial decrease in anti-adhesive properties. 13 Static contact angle measurements were determined with 18.2 MV cm water (MilliQ) using a microsyringe with the submerged-point technique. 40 Preliminary adhesion measurements were obtained between bare, used-as-received Veeco NP contactmode tips (nominal spring constant and radius of curvature 0.58 N m 21 and 20-60 nm respectively) and the silanized wafers on a Veeco NanoScope IV MultiMode AFM.…”

“…1D) and then brought these tips into contact with a polymer 12 The temperature range was selected to span the glass transition of the polymer (72 uC). 13 We measured the force required to disengage the tip from the polymer. As Bhushan describes in some detail, 11 force-displacement plots provide a deceptively simple method of determining surface adhesion.…”

Polymeric-Based In Vitro Diagnostic Devices

“…2.4 The schematic hot embossing process. The total force (F) required to emboss a thermoplastic polymer depends on the polymer's viscosity, contact area of the stamp features with the polymer (c), surface area of the entire stamp (C) and temperature [84] process produces heat to the sample; somehow, it would cause polymer to reflow and affect the morphology [92].…”

“…Figure 2.4 depicts a schematic of the hot-embossing process [84]. The applied pressure to hold the template and sheet, pressed time, and operation temperature are the most important factors influencing the end quality of the embossed structures on the chip surface.…”

Microfluidics technology: future prospects for molecular diagnostics

“…Microfluidics technology thermoforming, 28 hot embossing, 29 and injection molding, 30 which makes it possible to mass produce microfluidic chips with integrated connectors. However, injection molding is not an ideal fabrication process for the science community because for high throughput and resolution, it is usually associated with expensive equipment and long turnaround times for the mold fabrication.…”