Chemical force microscopy for hot-embossing lithography release layer characterization

Cameron, Neil S.; Ott, Arnaud; Roberge, Hélène; Veres, Teodor

doi:10.1039/b600936k

Cited by 13 publications

(11 citation statements)

References 36 publications

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“…1-iii). Elucidating the details of the embossing process is not trivial, especially in the nano-regime, and instrumented approaches such as one-dimensional surface probe microscopy 8 and indentation are useful techniques to explore the development of micro-and nano-motifs. 15 The most complicated regime occurs when the residual film thickness between the stamp motifs and the support underlayer approaches the polymer coil dimension.…”

Section: Hot Embossing Processmentioning

confidence: 99%

“…2), as described in detail elsewhere. 8,26 The smallest motifs we routinely replicate by HEL are less than 100 nm in critical dimension, 7,27 and substrate film thicknesses vary from a few tens of nm to more than a few mm. In this preliminary study, we present our interpretation and optimization of the replication of micro-motifs for lab-onplastic-chip applications.…”

Section: Hot Embossing Processmentioning

confidence: 99%

“…The silicon stamps were treated with 1,1,2,2-tetrahydroperfluorotrichlorosilane in the vapour-phase to facilitate de-embossing. 8 …”

Section: Experimental Stamp Fabricationmentioning

confidence: 99%

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High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction

et al. 2006

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Section: Hot Embossing Processmentioning

confidence: 99%

Section: Hot Embossing Processmentioning

confidence: 99%

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High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction

et al. 2006

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“…When the temperature is too low, the polymer will lack flow ability, which results in a high amount of recovery and large distortions after demolding. When the imprint temperature is too high, the polymer molecule may be broken and self-assembly may occur, which will impact on the following use of finish products (Cameron et al 2006). On the other hand, high imprint temperature will waste more time in increasing/decreasing temperature process, which results in low embossing efficiency.…”

Section: Resultsmentioning

confidence: 99%

Analysis of pattern height development in hot embossing process

Chen

2009

Microsyst Technol

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The pattern height of hot embossing was analyzed based on the polymer power-law material assumption for better controlling product quality. The time development of the polymer substrate height, pattern height and the imprint pressure were obtained. The imprint temperature with respect to the pattern height was discussed. Theory analysis shows that in a constant imprint pressure, the pattern height has a power relationship with the imprint time. At the beginning imprint stage, as for the elastic response of polymer, the pattern height increases rapidly. With the time increasing, the polymer deform is mainly caused by creep and this results in low imprint speed. On the other hand, the increasing friction force between the polymer and the mold will further reduce the imprint speed. The theoretical data were compared with experiments and the results show that this model can well predict the rule of polymer substrate thickness variation.

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“…Atomic force microscopy (AFM) with functionalized AFM tips is currently used for a wide range of applications. Chemical force microscopy (CFM) uses functionalized AFM tips to characterize chemical properties of surfaces by measuring the intermolecular adhesion and desorption forces between the AFM tip and the surface . If the tip and the substrate are functionalized with the opposite components of a specific molecular pair, e.g., biotin–avidin pair, one can perform molecular recognition in CFM .…”

mentioning

confidence: 99%

Infrared Vibrational Spectroscopy of Functionalized Atomic Force Microscope Probes using Resonantly Enhanced Infrared Photoexpansion Nanospectroscopy

Jin

Belkin

2019

Small Methods

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Reported is the measurement of infrared absorption spectra of 4‐nitrothiophenol and hydroxyl‐terminated hexa(ethylene glycol) molecules at apices of functionalized atomic force microscope (AFM) probes using resonantly enhanced infrared photoexpansion nanospectroscopy, also known as resonantly enhanced AFM‐IR technique. The experiment demonstrates the applicability of the AFM‐IR technique to perform spectroscopy of only a few tens of molecules on AFM tip apices and demonstrates the potential of the AFM‐IR technique to perform vibrational spectroscopic studies of chemical reactions and molecular conformational changes on the apices of functionalized AFM tips.

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Chemical force microscopy for hot-embossing lithography release layer characterization

Cited by 13 publications

References 36 publications

High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction

High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction

Analysis of pattern height development in hot embossing process

Infrared Vibrational Spectroscopy of Functionalized Atomic Force Microscope Probes using Resonantly Enhanced Infrared Photoexpansion Nanospectroscopy

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