2013
DOI: 10.1016/j.egypro.2013.07.279
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High Efficiency Fully Implanted and Co-annealed Bifacial N-type Solar Cells

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Cited by 21 publications
(18 citation statements)
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“…The dissolution of these defects (like dislocation loops [3] or boron interstitial clusters [4,5]) requires either a high temperature step (several 10 min above 1000°C) after implantation (e.g. [6]) or an etch-back step of the emitter surface after annealing at lower temperatures [7].…”
Section: Introductionmentioning
confidence: 99%
“…The dissolution of these defects (like dislocation loops [3] or boron interstitial clusters [4,5]) requires either a high temperature step (several 10 min above 1000°C) after implantation (e.g. [6]) or an etch-back step of the emitter surface after annealing at lower temperatures [7].…”
Section: Introductionmentioning
confidence: 99%
“…In both separated and co-annealing methods, the dopants are inserted into the cell by ion implantation and activated by subsequent thermal treatments. In these approaches, the number of process steps related to doping is reduced by 4 for the co-annealing [7] and by 3 for separated annealing, in comparison to the 11 steps needed for doping by diffusion. Using ion implantation, the steps of barrier and dopant glass removal are eliminated and the oxidation is done during the activation annealing.…”
Section: Methodsmentioning
confidence: 99%
“…Here, two ways exist to increase the thermal budget: 1) increasing the temperature or/and 2) increasing the annealing duration. So far, experimental studies were performed in quartz furnaces, implying maximum T of ß1050°C and long annealing times up to ß1 h (see [10]). Higher T, which can be achieved by using RTA, could lead to a faster dissolution of crystal defects and, thus, enables shorter process duration.…”
Section: Introductionmentioning
confidence: 99%