High density test structure array for accurate detection and localization of soft fails

Newly developed Test-Element-Group for detecting soft failures of the low-resistance-element using doubly nesting array

“…To detect the soft failure in early stage of process development is needed for improving the product reliability since the soft failure has the potential of degrading to the hard failure after shipping. Various TestElement-Group (TEG) used for process development has been reported for managing yield and detecting the failure of the element [1][2][3][4]. We report newly developed TEG for detecting soft failures of low-resistance-element like interconnect via using doubly nesting array, which is named as Highsensitivity-Screening-and-Detection-decoder TEG (HSD-TEG).…”

4K-cells Resistive and Charge-Base-Capacitive Measurement Test Structure Array (R-CBCM-TSA) for CMOS Logic Process Development, Monitor and Model

“…Only few of them can be used for capacitor measurements [12], [13]. To address the "soft failing", Hess et al employed a high density resistive-type array with 4-termainl Kelvin force/sense [14]. The aforementioned test chip either focused on high density array of transistors or resistors.…”

“…To resolve and minimize the parametric variation induced by process variation as well as spatial effect and enable the defect detection capability of high spatial resolution, the array-type design was used to characterize the electrical performance of the various types of test structure such as transistors, diodes, resistors, capacitor [2]- [14]. Only few of them can be used for capacitor measurements [12], [13].…”