High density packaging of vertical-cavity surface-emitting laser arrays using micro-machined springs

Chua, C.L.; Fork, D. K.; Smith, Daniel; McIntyre, Harry Jonathan; Ma, Da; Жу, Анфу; Modi, Mitul; Sitaraman, S.K.

doi:10.1109/leos.2000.894019

Cited by 1 publication

(3 citation statements)

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“…If (3) is complex, then the stable solution is not an elliptical curvature, but rather a spherical one. In order for the solution to be real, hence an elliptical curvature past the bifurcation point, the quantity under the square root should be greater than zero (4) For a given intrinsic stress and laminate material properties, the minimum that causes (4) to be true is the where the spherical curvature solution separates into two stable elliptical curvature solutions, that is the critical bifurcation point . Expanding in (4) and solving for gives an equation for as follows: (5) In (5), represents material and loading information and are expanded fully in Appendix A.…”

Section: B Microcontact Spring Fabrication Design Guidelinesmentioning

confidence: 99%

“…When fabricated on a substrate, these interconnects become probes for wafer-level packaging (WLP) test and burn-in applications. More information about the application and benefits of microcontact springs may be found in [2]- [4]. In probing applications, increasing the spring thickness is often desired.…”

Section: Introductionmentioning

confidence: 99%

“…Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TCAPT.2008.Array of 4-m-wide springs on 6-m pitch[4].…”

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confidence: 99%

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Microcontact Spring Reliability: Design Against Interfacial Fracture

Modi

Ginga

Sitaraman

2009

IEEE Trans. Comp. Packag. Technol.

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The microcontact spring technology, based on stressengineered thin film strips, is a potential solution to the International Electronics Manufacturing Initiative (iNEMI) forecasted flip chip die-to-package interconnect requirements. Preventing interfacial fracture due to monotonic loading during fabrication of these springs is one primary issue to ensure its reliability. This work applies a combined analytical and experimental framework to examine the interfacial integrity of microcontact springs, which are a form of thin film cantilevered plates. An analytical model, based on nonlinear plate theory, is discussed and validated for its use as a tool for predicting structural reliability in thin film cantilevers (i.e., microcontact springs). Further application of the plate theory is used to understand design guidelines of the microcontact spring to minimize delamination and to understand the impact of bifurcation of curvature on delamination. Finally, experimental interfacial fracture toughness data, based on the results of a modified decohesion test (MDT), are discussed and applied to create a design map for microcontact spring fabrication. Although this work is being applied to the application of microcontact springs, most of the trends are generic to any intrinsically stressed film plate.

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Section: B Microcontact Spring Fabrication Design Guidelinesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%