High pixel per inch and high‐resolution micro‐LED displays are attracting more and more attentions. The increasing pixel number requires a large amount of bonding pads and brings huge difficulties to micro‐LED system design and lowers power efficiency as well. It is urgent to integrate row and column driving circuits onto the micro‐LED panel. Here, we report a fully integrated active matrix programmable micro‐LED system on panel (SoP) with ultraviolet and blue emission wavelengths. The micro‐LED SoP has a resolution of 60 × 60 and pixel pitch of 70 μm. The micro‐LED SoP was achieved by integrating micro‐LED arrays with silicon‐based p‐channel metal‐oxide semiconductor driving panel using fine‐toned flip‐chip bonding technology. With fully integrated scan and data circuits, the number of bonding pads was greatly reduced from 136 to 28, and large amount of metal interconnection lines were saved. The micro‐LED SoP panel was mounted on a periphery driving board, and representative characters were displayed successfully.