High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications

Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche, C. T.; Ndip, Ivan; Krohnert, Kevin; Lang, Klaus‐Dieter

doi:10.23919/iwlpc.2019.8914091

2019 International Wafer Level Packaging Conference (IWLPC) 2019

DOI: 10.23919/iwlpc.2019.8914091

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High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications

Kai Zoschke

Piotr Mackowiak

Ha-Duong Ngo

et al.

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Cited by 3 publications

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Key Technologies and Design Aspects for Wafer Level Packaging of High Performance Computing Modules

Zoschke,

Oppermann,

Schiffer

et al. 2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications

Cited by 3 publications

References 12 publications

Key Technologies and Design Aspects for Wafer Level Packaging of High Performance Computing Modules

Key Technologies and Design Aspects for Wafer Level Packaging of High Performance Computing Modules

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