High-density and high-pin count flexible SMD connector for high-speed data bus

Sasaki, Shigenobu; Kishimoto, T.

doi:10.1109/iemt.1993.398173

Cited by 4 publications

(2 citation statements)

References 3 publications

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“…An FPC cable more than 6 cm long is needed to connect the neighboring circuit boards. The newly developed FPC cable has a meshed structure for the ground layers and a hollow structure [3] to improve cable flexibility when comparing to general FPC cables [4], [5]. For operators of the system, improvement of cable flexibility allows the cable to be easily pushed into and pulled out of a connector.…”

Section: A Fpc Cablesmentioning

confidence: 99%

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High-speed signal transmission at the front of a bookshelf packaging system

Koike

Kaizu

Kishimoto

1997

IEEE Trans. Comp., Packag., Manufact. Technol. B

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A front-connection technique using the front-side of the circuit board in rack systems configured like bookshelves is proposed to increase pin-counts for high-through-put switching modules (>20 Gb/s). This configuration technique was implemented using newly developed front connectors and flexible printed-circuit (FPC) cables that are both impedance-matched. This configuration enables the use of a new transmission route that meanders through every signal transmission line of every circuit board, backplane, and FPC cable. This route can extend the functional block size from the size of the circuit board to that of the unit. In a signal transmission experiment between circuit boards with this meander route passing through signal lines of an 18-cm-long FPC cable and over a distance of ten slots in the backplane, error-free (<10 011 ) signal transmission of 2 23 0 1 nonreturn-to-zero (NRZ) pseudo-random bit sequences (PRBS) at 622.08 Mb/s was obtained.Index Terms-Bookshelf packaging system, FPC cable, front connector, functional block, meander routes.

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Section: A Fpc Cablesmentioning

confidence: 99%

“…By interconnecting the circuit boards at the front of the system, the throughput is more than doubled compared to a conventional bookshelf packaging system. The boards are connected using our newly developed front connectors and FPC cables [3]. Fig.…”

Section: Introductionmentioning

confidence: 99%

High-speed signal transmission at the front of a bookshelf packaging system

Koike

Kaizu

Kishimoto

1997

IEEE Trans. Comp., Packag., Manufact. Technol. B

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80 Gbit/s ATM switch MCM based on multi-layer ceramic technology

et al. 1999

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Multichip module technologies for high-speed ATM switching systems

Sasaki

Kishimoto

Genda

et al.

Proceedings of the International Conference on Multichip Modules

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High-performance, compact multichip modules (MCMs) using a copper polyimide multi-layer substrate are used to make a 40-Gb/s-throughput ATM switching module. The MCM substrate has 392 high-speed signal YO channels, thin-film termination resistors, and 50 pm laminated capacitance layers. We made a subswitching element module using these MCMs, new high-speed FPC cables, and heat pipes fins. This sub-switching element module can operate at 80 Gb/s throughput.

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High-density and high-pin count flexible SMD connector for high-speed data bus

Cited by 4 publications

References 3 publications

High-speed signal transmission at the front of a bookshelf packaging system

High-speed signal transmission at the front of a bookshelf packaging system

80 Gbit/s ATM switch MCM based on multi-layer ceramic technology

Multichip module technologies for high-speed ATM switching systems

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