2016
DOI: 10.1109/led.2016.2523269
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High-Current Tunneling FETs With (110) Orientation and a Channel Heterojunction

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Cited by 23 publications
(20 citation statements)
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“…Heterojunction TFETs have been simulated by using the NEGF approach with both a TB [83,115,132,133], and a · k p Hamiltonian [62,124,126,131,134]. The use of the GaSb/InAs hetero-junction usually provides a larger I ON compared to InAs homojunction TFETs, but such a potential improvement is partly frustrated by quantum confinement effects that tend to turn the supposedly broken-bandgap GaSb/InAs hetero-junction into an actually staggered band alignment system, as illustrated in figure 15.…”
Section: Hetero-junction Modeling and Engineeringmentioning
confidence: 99%
“…Heterojunction TFETs have been simulated by using the NEGF approach with both a TB [83,115,132,133], and a · k p Hamiltonian [62,124,126,131,134]. The use of the GaSb/InAs hetero-junction usually provides a larger I ON compared to InAs homojunction TFETs, but such a potential improvement is partly frustrated by quantum confinement effects that tend to turn the supposedly broken-bandgap GaSb/InAs hetero-junction into an actually staggered band alignment system, as illustrated in figure 15.…”
Section: Hetero-junction Modeling and Engineeringmentioning
confidence: 99%
“…Similar to the locally strained nTFET cases, the source-to-channel tunnel probability increases while the source-to-drain leakage and ambipolar leakage are not infuenced. In addition, the sourceto-channel tunnel barrier thickness is further reduced by the valence band discontinuity (between strained and unstrained parts), similar to the channel heterojunction design [10]. For nTFETs, unfortunately, we could not employ the same design, i.e., extending the locally strained area into the channel and make use of the conduction band discontinuity.…”
Section: B P-type Tfetsmentioning
confidence: 99%
“…But its drive current (I ON ) is usually limited by the small tunnel probability [1] leading to pronounced switching delay (CV/I). Various methods have been proposed to improve I ON , such as the doping engineering [2], [3], different channel materials (including low band gap III-V materials and two-dimensional materials) [4], broken/staggered gap heterojunction [4], [5], grading of the source [6], resonant enhancement [7]- [9], and channel/source heterojunctions [10], [11].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…3 Numerous strategies have been adopted so far in terms of device geometry and materials in order to address the problem in these tunneling transistors. Of them, double gate (DG) TFETs, 4 heterojunction (HJ) TFETs, [5][6][7][8][9][10] cylindrical TFETs, 11 dual metal gate TFETs, 12 Carbon Nanotube (CNT) TFETs, 13 III-V TFETs, 14 and gate engineered TFETs 15 are the most significant.…”
Section: Introductionmentioning
confidence: 99%